Reworkable thermal deadhesion adhesive tape for manufacture procedure and preparation method of adhesive tape

A heavy-duty thermal and adhesive tape technology, applied in the direction of adhesives, adhesive types, grafted polymer adhesives, etc., can solve difficult-to-bond objects with rough surfaces, affect process stability, and increase adhesion etc. to improve the cohesive performance, improve the bonding stability, and reduce the adhesion

Inactive Publication Date: 2019-06-21
苏州义铠轩电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These two tapes have certain disadvantages. It is difficult for the low-adhesive pressure-sensitive adhesive tape to bond objects with rough surfaces, and the adhesive force will increase with the extension of time and the increase of temperature and pressure. Peeling; while the adhesive layer of the thermally debonding adhesive tape with thermal expansion microspheres basically disappears after thermal debonding, which will easily lead to complete separation b

Method used

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  • Reworkable thermal deadhesion adhesive tape for manufacture procedure and preparation method of adhesive tape
  • Reworkable thermal deadhesion adhesive tape for manufacture procedure and preparation method of adhesive tape
  • Reworkable thermal deadhesion adhesive tape for manufacture procedure and preparation method of adhesive tape

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Embodiment 1~4

[0036] Embodiments 1 to 4: A reworkable thermal adhesive tape for manufacturing process, comprising a substrate layer and a thermal adhesive layer coated on the surface of the substrate layer, the substrate layer is made of a 12 μm PET film,

[0037] The heat-losing adhesive layer comprises the following components in parts by weight:

[0038] Table 1

[0039]

[0040] The above-mentioned styrene-isoprene-styrene block copolymer is a linear SIS without diblock SI, the softening point of the thermoplastic phenolic resin is 82°C, and the solvent is a mixture of toluene and ethyl acetate.

[0041] The antioxidant of above-mentioned embodiment 1 is antioxidant 1076, the antioxidant of embodiment 2 is antioxidant 168, the antioxidant of embodiment 3 is antioxidant 1010, the antioxidant of embodiment 4 is antioxidant Agent 164.

[0042] The preparation method of the reworkable heat loss adhesive tape for the above process comprises the following steps:

[0043] S1. Add styrene...

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Abstract

The invention discloses a reworkable thermal deadhesion adhesive tape for manufacture procedure. The adhesive tape comprises a substrate layer and a thermal deadhesion adhesive layer coating the surface of the substrate layer, wherein the thermal deadhesion adhesive layer comprises components as follows: butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, hydroxyethyl methylacrylate, a styrene-isoprene-styrene block copolymer, thermoplastic phenolic resin, methylbenzotriazole, N,N-diethylaniline, azodiisobutyronitrile, 4,4'-diaminodiphenyl ether, polyethylene wax, gamma-methacryloxy propyl trimethoxyl silane, an antioxidant and a solvent. The reworkable thermal deadhesion adhesive tape for the manufacture procedure has notably reduced adhesion after being heated, can be easily stripped from an attached object and is convenient to rework, the adhesion of the adhesive layer can recover after the adhesive tape recovers the normal temperature, therefore, the adhesive tape can be recyclable, and the economic cost is saved.

Description

technical field [0001] The invention relates to an adhesive tape, in particular to a reworkable heat-unbonding adhesive tape for manufacturing processes and a preparation method thereof. Background technique [0002] With the development of science and technology, the degree of automation is getting higher and higher. The continuity and simplification of product production process has become an important means to improve the competitiveness of enterprises. At present, in order to ensure the continuity and simplicity of production process, high-end electronic products usually require Take certain protective measures for electronic components. [0003] At present, there are roughly two main protective measures: one is to use low-adhesive pressure-sensitive adhesive tapes, and the other is to use thermally debonding tapes with thermal expansion microspheres. These two tapes have certain disadvantages. It is difficult for the low-adhesive pressure-sensitive adhesive tape to bon...

Claims

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Application Information

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IPC IPC(8): C09J7/25C09J7/30C09J151/00C09J161/06C09J11/06C08F287/00C08F220/18C08F220/14C08F220/20
Inventor 沈雅琴徐杰
Owner 苏州义铠轩电子科技有限公司
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