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Dynamic random access memory module

A dynamic random access, memory module technology, applied in static memory, digital memory information, information storage, etc., can solve the problems of limited fan convection heat dissipation and unsatisfactory heat dissipation efficiency.

Inactive Publication Date: 2019-07-12
ADATA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical applications, the effect of fan convection heat dissipation is limited. The heat dissipation method of metal direct contact or with metal heat conduction sheet connected to heat conduction liquid, the heat conduction effect will be limited by the heat conduction path. Not only should the area of ​​the contact surface be sufficient and Whether the heat conduction efficiency of the contact surface is uniform, etc. In the past, the solution of indirect heat dissipation through the connection of the metal heat conduction sheet to the heat conduction liquid also has the problem of multiple medium conversions on the conduction path, and the heat dissipation efficiency is difficult to be called ideal.

Method used

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Examples

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no. 1 example

[0023] see Figure 1 to Figure 4 as shown, figure 1 It is a three-dimensional combination diagram of a dynamic random access memory (dynamic random access memory, DRAM for short) module M according to the first embodiment of the present invention, figure 2 It is a three-dimensional exploded schematic view of the DRAM module M of the first embodiment of the present invention, image 3 It is a three-dimensional combined schematic diagram of the housing 1 of the first embodiment of the present invention, Figure 4 It is a schematic cross-sectional view of the DRAM module M according to the first embodiment of the present invention. As can be seen from the above figures, the first embodiment of the present invention provides a DRAM module M, which includes a housing 1 , a circuit board 2 and an electronic fluorinated liquid 3 . The housing 1 has an accommodating space 11 inside, and the circuit board 2 is arranged in the housing 1 , and the electronic fluorinated liquid 3 is s...

no. 2 example

[0037] see again Figure 4 As shown, in the DRAM module M of the present invention, in addition to the electronic fluorinated liquid 3 used in the first embodiment, in addition to the compound used in the first embodiment, in other possible implementations of the present invention, the following structure can also be used Represented compound: Y-R f -CH 2 OCH 2 R f ’-Y.

[0038] where R f and R f ’ each contain at most one hydrogen atom, and R f and R f ' are the same or different following groups: perfluorinated linear, cyclic, or branched alkylene groups having 1 to 10 carbon atoms, partially fluorinated linear, cyclic, having 1 to 10 carbon atoms , or branched chain alkylene and derivatives in which one or more carbon atoms of the aforementioned various compounds are replaced by bonded nitrogen or oxygen heteroatoms; wherein, Y includes H, F or R f CH 2 OCH 2 - one or more than two groups; the compound molecule includes at least 6 carbon atoms. Preferably, where...

no. 3 example

[0041] borrow the following Figure 4 to Figure 6 A third embodiment of the present invention will be described. see Figure 4 to Figure 6 as shown, Figure 4 It is a schematic cross-sectional view of the DRAM module M of the first embodiment of the present invention, Figure 5 It is a three-dimensional exploded schematic diagram of the DRAM module M of the third embodiment of the present invention, Image 6 It is a three-dimensional assembly diagram of the DRAM module M according to the third embodiment of the present invention. It can be seen from the above figure that at least one light emitting module 23 is arranged on the circuit substrate 2 of the third embodiment of the present invention, and the light emitting module 23 is accommodated in the accommodating space 11. In this embodiment, the light emitting module 23 includes red light The light-emitting unit, the green light-emitting unit and the blue light-emitting unit (not numbered separately), so that light of di...

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Abstract

The instant disclosure provides a dynamic random access memory (DRAM) module including a housing, a circuit board and a fluorine engineered fluid. The housing includes an accommodating space and an opening on a side thereof. The circuit board has at least a DRAM chip disposed thereon. The circuit board is received in the accommodating space and one end of the circuit board has at least a circuit contact protruding from the opening to the exterior of the housing. The fluorine electronic engineering fluid is sealed in the accommodating space and is thermally connected to at least one of the DRAMchip. Therefore, the dynamic random access memory module can be sustained in an optimal working temperature, and furthermore the dynamic random access memory module can operate in a state which can maintain highest efficiency.

Description

technical field [0001] The invention relates to a dynamic random access memory module, in particular to a dynamic random access memory module in which the casing is filled with electronic fluorinated liquid. Background technique [0002] The operating performance of dynamic random access memory (DRAM) is closely related to the operating temperature. In order to ensure that DRAM operates at an optimal operating temperature, a good heat dissipation solution has always been the focus of related industries. one. [0003] At this stage, the heat dissipation methods are nothing more than heat conduction of metal contact products, fan convection heat dissipation, or indirect heat dissipation through metal heat conduction sheets connected to thermal fluid. However, in practical applications, the effect of fan convection heat dissipation is limited. The heat dissipation method of metal direct contact or with metal heat conduction sheet connected to heat conduction liquid, the heat c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/043H01L23/44H01L25/16
CPCH01L23/44H01L25/167H01L23/043H01L23/42H01L23/3737G11C5/04G11C7/04H05K7/20236H05K7/1427H05K1/181H05K5/069H05K2201/064F21Y2113/10H05K2201/10121F21V29/87F21V29/58F21V29/503F21V29/508H05K2201/10159H10B12/00
Inventor 张立明蔡丰米蔡仕皇詹景森
Owner ADATA