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Ceramic feed-through, solder and welding method

A welding method and solder technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of complex manufacturing process and high processing cost, and achieve the effect of simplifying the production process and reducing the production cost

Pending Publication Date: 2019-07-16
河北躬责科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] This application proposes a ceramic feedthrough, solder and welding method, which solves the problems of high processing cost and complicated manufacturing process in the prior art

Method used

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  • Ceramic feed-through, solder and welding method
  • Ceramic feed-through, solder and welding method
  • Ceramic feed-through, solder and welding method

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Embodiment Construction

[0025] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0026] The technical solutions provided by various embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

[0027] The embodiment of the present application proposes a solder, which includes: gold powder, active Ti powder, and ethyl cellulose binder.

[0028] The gold powder is added in...

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Abstract

The invention discloses a ceramic feed-through, solder and a welding method. The ceramic feed-through, the solder and the welding method solve the problems of high processing cost and complex manufacturing process in the prior art. The solder comprises a solid powder material and an ethyl cellulose adhesive, wherein gold powder accounts for 95-98wt% of the solid powder, active powder accounts for2-5wt% of the solid powder, and the addition amount of the ethyl cellulose adhesive is 10-40wt% of the solid powder. The titanium ring welding method for the high-density ceramic feed-through comprises at least printing the solder on a ceramic feed-through sheet. A titanium ring is placed on the ceramic feed-through sheet and then placed in a vacuum furnace for welding. The ceramic feed-through welded with the titanium ring comprises the ceramic feed-through sheet, the titanium ring and a welding layer. The ceramic feed-through sheet is fixedly connected with the titanium ring. The welding layer is used for welding the ceramic feed-through sheet and the titanium ring. According to the ceramic feed-through and welding method, on the premise of simplifying the production process and reducingthe production cost, a product can still meet requirements of biocompatibility, air tightness and reliability on an implanted medical device.

Description

technical field [0001] The present application relates to cermet welding, in particular to a ceramic feedthrough, solder and welding method. Background technique [0002] Ceramic feedthrough is the core component of implantable medical devices. It is the airtight protection carrier of device electrical signal input and output channels, power supply channels and device chips, and is the key to the survival and function of implantable devices. The basic requirements for ceramic feedthroughs for implantable medical devices are hermeticity, reliability and biocompatibility. [0003] In the practical application of ceramic feedthroughs, in order to form an airtight cavity, it is often necessary to weld ceramic feedthrough pieces and titanium sealing rings. [0004] The welding process of the current ceramic feedthrough sheet and titanium ring is complicated. It is necessary to pre-fabricate a Ti-Nb or Ti-Pt thin film metallization ring on the ceramic sheet by evaporation or sput...

Claims

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Application Information

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IPC IPC(8): B23K1/008B23K1/20B23K35/30
CPCB23K1/008B23K1/203B23K35/3013
Inventor 郑颖
Owner 河北躬责科技有限公司
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