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A kind of ABS type adhesive tape solder and preparation method thereof

A solder and adhesive tape technology, applied in welding equipment, manufacturing tools, metal processing equipment, etc., can solve long-term problems, and achieve the effect of short time consumption, simple method and high viscosity

Active Publication Date: 2021-06-15
KUNMING INST OF PRECIOUS METALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem mainly solved by the present invention is to provide a simple and easy-to-control process and a more environmentally friendly solvent method for the existing sticky solder. The product obtained by this method has greater viscosity, is easy to weld, and has a longer storage time

Method used

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  • A kind of ABS type adhesive tape solder and preparation method thereof
  • A kind of ABS type adhesive tape solder and preparation method thereof
  • A kind of ABS type adhesive tape solder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1 thickness is the preparation of the AgMnAl adhesive tape solder of 0.4mm

[0027] (1) Weigh 2.6g of ABS resin and dissolve it in 30g of acetone. After fully dissolving, add 1.4g of dibutyl phthalate and 2.6g of butyl acetate solution to mix. Put the mixed solution into a 65°C beaker and heat it in a water bath. Until the solution has no bubbles, weigh the mass of the remaining solvent, and add butyl acetate to make up the total mass of the solution to 6.6g.

[0028] (2) Weigh 46g of 300-mesh silver-aluminum-manganese solder powder, mix it with the prepared binder solution, stir it evenly, pour it into a tray and place it in an oven, adjust the temperature to about 50°C, Keep it warm for 30 minutes, take it out when the solder is muddy, and add butyl acetate dropwise if it is too dry.

[0029] (3) Put the muddy solder into the rolling mill, adjust the roller spacing to 1.5mm, and perform more than 20 repeated rolls until the solder is uniform in color and h...

Embodiment 2

[0036] Embodiment 2 thickness is the preparation of the AgMnAl adhesive tape solder of 0.2mm

[0037] The difference is that the 600 mesh 44g AgAlMn solder powder, 3.6g ABS resin, 2.4g dibutyl phthalate, and 2.4g butyl acetate are used to make a binder solution, and the mixed and dried solder is placed In a roll mill, roll both sides according to the roller spacing of 2mm, 1.5mm, 1mm, 0.5mm, and 0.4mm, and then place it in a cool place to dry naturally.

[0038] Performance indicators of adhesive tape solder:

[0039] Thickness 0.206mm

[0040] Breaking strength 3.2N

[0041] Impact breakage mass 98g

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Abstract

The invention discloses an ABS type adhesive tape solder and a preparation method thereof. It is a method for preparing metal solder powder which is difficult to be rolled into a soft cloth-shaped ribbon solder. The method adopts an organic binder (ABS resin and toughening agent dibutyl phthalate) are evenly mixed with metal solder powder, and rolled repeatedly to prepare adhesive tape solder. Adhesive tape solder is a kind of flexible and viscous ribbon-shaped solder. It has the advantages of simple welding operation and controllable welding area. It is used for brazing of high-temperature brittle alloys and can weld complex fractures. Paste it on the parts to be welded, put it into a vacuum brazing furnace or use gas shielded welding to weld. The raw material of the invention is simple and easy to obtain, low in cost, simple in preparation process and environmentally friendly, and the sticky solder as a product has the characteristics of smooth surface, uniform thickness, high viscosity, simple welding operation, low welding ash content, etc., and can simplify the welding process.

Description

technical field [0001] The invention belongs to the field of welding technology, and relates to a composition and a preparation and molding method of an ABS type adhesive tape solder, and specifies the welding process. Background technique [0002] Solder is the filler added in the joint gap or next to the gap between two materials. The solder is mainly supplied in the form of powder, filament, strip, sheet, etc. Among them, the use of solder sheet for welding has a small oxidation area during welding. , after welding, the appearance is beautiful, the materials are uniform, and there are few advantages such as lack of welding and missing welding, but the production of welding sheets requires metal brazing filler metals to have certain ductility, among which gold, silver, and copper-based metals have better ductility. It can be rolled into a foil strip, but the Si, Mn, B, P and other alloying elements added to the high-temperature sticky solder to lower the melting point make...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/40B23K35/36B23K1/008
CPCB23K1/008B23K35/3612B23K35/40
Inventor 谢明成建沣陈永泰杨有才胡洁琼方继恒张吉明王松李爱坤王塞北陈松刘满门侯攀陈贇马宏伟段云昭
Owner KUNMING INST OF PRECIOUS METALS
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