Wafer alignment method and pre-alignment mechanism thereof and conveying mechanical arm

Abstract

The invention provides a wafer alignment method and a pre-alignment mechanism thereof and a conveying mechanical arm, relates to a process and a device used in the field of wafer transmission, and aims at providing a wafer alignment method with simple structure, low cost and simple operation, a pre-alignment mechanism thereof and a conveying mechanical arm. The bottom of the wafer conveying mechanical arm with a pre-alignment function is mainly used. A direct drive motor is arranged to drive the whole alignment mechanism to rotate around the vertical axis. The mechanism body is a mechanical arm mechanism in which the motor drives the end actuator to perform telescopic movement through a synchronous belt, or a linear motor drives the end actuator to perform telescopic movement directly. A wafer pre-alignment mechanism is installed inside the mechanical arm, the lifting motion is driven by a cylinder and the rotating motion is driven by the direct drive motor. Therefore, the pre-alignment behavior can be performed directly after the wafer is taken by the end actuator of the mechanical arm and the wafer is taken and moved directly to the designated position for placing the wafer afterthe alignment, thereby greatly saving the time from the wafer pickup point to the alignment mechanism in the past.

Description

technical field [0001] The invention relates to the field of IC manufacturing, in particular to a method for aligning wafers for transporting wafers, a pre-alignment mechanism, and a transporting robot arm. Background technique [0002] With the development of society, the information age is getting farther and farther, the integrated circuit industry is in full swing, and the demand for peripheral related equipment is also increasing. Manipulators have also appeared in various forms. [0003] see figure 1 and 2 , due to the particularity of the wafer, in the process, on the one hand, it is necessary to use the manipulator to transport the wafer from point A to point B. In most cases, it is necessary to perform a series of alignment operations before the handling to ensure Wafer orientation to point B is consistent. At present, the pre-alignment equipment on the market is basically independent, so usually the wafer handling and alignment operations are performed by two i...

AI Technical Summary

Problems solved by technology

[0007] However, this form requires the manipulator to reciprocate between points A, C, and B, which increases the handling time of a single wafer and affects the production capacity of the whole machine.

[0008] Moreover, in the existing pre-alignment equipment Aligner technology, the equipment has four degrees of freedom, resulting in the need for four driving devices, which increases the overall cost, and because the pre-alignment equipment exists independently of the manipulator, the complete machine equipment The outline size becomes larger, and because the pre-alignment equipment Aligner and the manipulator exist independently, the time for wafer handling increases, which is not conducive to the improvement of production line capacity

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