High thermal conductivity thermal conduction silica gel gasket and preparation method thereof

Abstract

The invention discloses a high thermal conductivity thermal conduction silica gel gasket and a preparation method thereof. According to the present invention, a thermal conduction powder filler, methyl vinyl silicone oil, hydrogen-containing silicone oil, an organic volatile dilution solvent, a silane coupling agent, a catalyst, an inhibitor and other components are used during the preparation, wherein the thermal conduction powder filler is wet by using the organic volatile dilution solvent so as to substantially reduce the viscosity of the thermal conduction powder base material and improvethe processability, and is subjected to surface modification and dispersion stirring by using an ultrasonic cavitation and mechanical stirring synergistic method so as to greatly increase the fillingamount of the powder filler and easily construct a thermal conduction path, such that the thermal conductivity of the thermal conduction silica gel gasket can be greatly improved; and after heating, the dilution agent in the base material is completely volatilized so as not to affect other performances of the obtained high thermal conductivity thermal conduction gasket.

Description

technical field [0001] The invention belongs to the field of thermal interface materials, and relates to a heat-conducting silica gel gasket, in particular to a heat-conducting silica gel gasket with high thermal conductivity and a preparation method thereof. Background technique [0002] In the field of electronic products, a large amount of heat will be generated during the operation of electronic components. In order to ensure the normal and stable operation of the equipment, the waste heat generated by power dissipation must be removed in time, otherwise the temperature of the electronic equipment will be too high and the operation stability will be reduced. and service life, and even cause circuit damage and system crash. Studies have shown that the reliability of electronic components is very sensitive to temperature. At the level of 70-80 °C, the reliability of the device will drop by 5% for every 1 °C increase in device temperature, and the failure rate of integrate...

AI Technical Summary

Problems solved by technology

However, the thermal conductive powder treated by the existing wet or dry surface modification process has the problems of local agglomeration and uneven wrapping of the surface modifier, which limits its dispersibility and addition amount in methyl vinyl silicone oil. An effective heat conduction path cannot be formed, resulting in a low thermal conductivity of the gasket, which cannot well meet the needs of practical applications.