IGBT device with SCR structure
A device, N-type technology, used in semiconductor devices, electrical components, circuits, etc., can solve the problems of device on-state characteristics and large switching loss, and achieve the effect of reducing leakage current, reducing turn-off time, and reducing turn-off loss.
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[0025] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.
[0026] An IGBT device with an SCR structure, the entire cell is symmetrical about the cell center line; its cell structure includes a metal electrode 7, a P+ collector region 6, an N-type buffer layer 5, and an N-drift region stacked in sequence from bottom to top 4. The metal emitter 9, the metal electrode 17 and the metal connection 18 are located above the N-drift region 4; the middle region of the top layer of the N-drift region 4 ...
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