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Heat transfer experimental device for electronic packaging microscale solder joint

An experimental device and electronic packaging technology, applied in the direction of material thermal conductivity, etc., can solve the problems of high temperature gradient and affect the reliability of small solder joints, and achieve the effect of improving accuracy, facilitating heat transfer, and ensuring cooling effect.

Inactive Publication Date: 2019-08-27
CHONGQING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Under the above conditions, the temperature gradient at both ends of the tiny solder joints will be higher, even reaching above 10000°C / cm, which will significantly affect the reliability of the tiny solder joints

Method used

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  • Heat transfer experimental device for electronic packaging microscale solder joint

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment one, see figure 1 , the thermomigration experimental device of micro-solder joints in electronic packaging shown, the device includes a heating mechanism 6, a fixture 7 and a cooling mechanism from top to bottom, and the fixture 7 is arranged in the space between the heating mechanism 6 and the cooling mechanism , used to fix the sample 8.

[0022] The cooling mechanism includes an outer shell 1, an inner shell 2 and a refrigerator 3. The inner shell 2 is provided with a cavity for containing the cooling liquid 4, and the outer shell 1 is sheathed on the outside. The outer shell 1 and the inner shell Body 2 fits snugly with no gap between the two. The refrigerating machine 3 passes through the outer shell 1 and the inner shell 2 to communicate with the cavity through the connecting pipeline 5 , and the temperature of the cooling liquid 4 is adjusted through the refrigerating machine 3 to realize the adjustable temperature of the cold end. The outer casing 1...

Embodiment 2

[0028] Embodiment two, adopt the thermomigration experimental device of electronic package micro-soldering point described in embodiment one to carry out the thermomigration experiment of micro-soldering point, it comprises the following steps:

[0029] S1, adjust the heating temperature of the heating core of the heating mechanism to 230°C, and wait for the heating mechanism to stabilize to the set temperature for standby;

[0030] S2, ethylene glycol and deionized water are used in a volume ratio of 2:1 to prepare cooling liquid. The freezing point of the cooling liquid is -68°C. Fill the cooling liquid into the cavity of the inner shell, turn on the refrigerator, and set the temperature to - 60°C, standby when the temperature drops to -60°C;

[0031] S3, using a Cu / Sn / Cu sandwich structure sample with a height of 5mm, wherein the height of the micro-soldering point is 50 μm, and the position of the micro-soldering point is located in the center of the sample, and the sample...

Embodiment 3

[0034] Embodiment three, using the thermomigration experimental device of electronic package micro-soldering point described in embodiment one to carry out the thermal migration experiment of micro-soldering point, it comprises the following steps:

[0035] S1, adjust the heating temperature of the heating core of the heating mechanism to 230°C, and wait for the heating mechanism to stabilize to the set temperature for standby;

[0036] S2, ethylene glycol and deionized water are configured as cooling liquid according to the volume ratio of 19:1. The freezing point of the cooling liquid is -99.5°C. Fill the cooling liquid into the cavity of the inner shell, turn on the refrigerator, and set the temperature to - 80°C, standby when the temperature drops to -80°C;

[0037] S3, using a Cu / Sn / Cu sandwich structure sample with a height of 4mm, wherein the height of the micro-soldering point is 15 μm, and the position of the micro-soldering point is located in the center of the sampl...

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Abstract

The invention discloses a heat transfer experimental device for an electronic packaging microscale solder joint. The device comprises a heating mechanism, a fixture and a cooling mechanism from top tobottom in sequence, wherein the fixture is arranged in a space between the heating mechanism and the cooling mechanism, and used for fixing a specimen; the cooling mechanism comprises an outer shell,an inner shell and a refrigerator; a cavity for accommodating cooling liquid is formed inside the inner shell; the inner shell is sleeved with the outer shell; the outer shell is in tight fit with the inner shell; the refrigerator passes through the outer shell and the inner shell through a connection pipeline, and communicates with the cavity; and the outer shell is made of a heat-insulating material, and provided with an avoiding gap at a position corresponding to the fixture, so that the specimen in the fixture is directly attached to the surface of the inner shell. Through adoption of theheat transfer experimental device, the temperature gradient reached by the electronic packaging microscale solder joint under an actual working condition or an extreme conditions can be effectively simulated, and the change of the microscale solder joint at a specific temperature gradient can be researched for assessing the reliability.

Description

technical field [0001] The invention relates to an extreme temperature gradient experimental device, in particular to a thermal migration experimental device for electronic packaging micro solder joints. Background technique [0002] With the advent of the era of big data, mobile devices have become ubiquitous; the development of the Internet of Things has made the communication between people and devices, and devices and devices more and more frequent; artificial intelligence is also constantly developing. With these improvements, we need increasingly high-performance electronics. However, the miniaturization of VLSI transistors based on Moore's Law has slowed down. Currently, the most promising way to extend Moore's Law is from two-dimensional integration of circuits to three-dimensional integration of circuits. Taking solder joints as an example, the size ranges from the largest 760μm BGA, to 100μm C4 flip-chip solder joints, to the smallest size 10μm micro bumps. The ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/18
CPCG01N25/18
Inventor 杨栋华杜飞杨明波潘宇张春红甘贵生冉藤翟翔
Owner CHONGQING UNIV OF TECH
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