Heat transfer experimental device for electronic packaging microscale solder joint

Abstract

The invention discloses a heat transfer experimental device for an electronic packaging microscale solder joint. The device comprises a heating mechanism, a fixture and a cooling mechanism from top tobottom in sequence, wherein the fixture is arranged in a space between the heating mechanism and the cooling mechanism, and used for fixing a specimen; the cooling mechanism comprises an outer shell,an inner shell and a refrigerator; a cavity for accommodating cooling liquid is formed inside the inner shell; the inner shell is sleeved with the outer shell; the outer shell is in tight fit with the inner shell; the refrigerator passes through the outer shell and the inner shell through a connection pipeline, and communicates with the cavity; and the outer shell is made of a heat-insulating material, and provided with an avoiding gap at a position corresponding to the fixture, so that the specimen in the fixture is directly attached to the surface of the inner shell. Through adoption of theheat transfer experimental device, the temperature gradient reached by the electronic packaging microscale solder joint under an actual working condition or an extreme conditions can be effectively simulated, and the change of the microscale solder joint at a specific temperature gradient can be researched for assessing the reliability.

Description

technical field

[0001] The invention relates to an extreme temperature gradient experimental device, in particular to a thermal migration experimental device for electronic packaging micro solder joints. Background technique

[0002] With the advent of the era of big data, mobile devices have become ubiquitous; the development of the Internet of Things has made the communication between people and devices, and devices and devices more and more frequent; artificial intelligence is also constantly developing. With these improvements, we need increasingly high-performance electronics. However, the miniaturization of VLSI transistors based on Moore's Law has slowed down. Currently, the most promising way to extend Moore's Law is from two-dimensional integration of circuits to three-dimensional integration of circuits. Taking solder joints as an example, the size ranges from the largest 760μm BGA, to 100μm C4 flip-chip solder joints, to the smallest size 10μm micro bumps. The ...

Images