Electromechanical integrated intelligent backboard satellite framework

Abstract

The invention discloses an electromechanical integrated intelligent backboard satellite framework. The electromechanical integrated intelligent backboard satellite framework comprises an intelligent backboard, wherein the intelligent backboard adopts a sandwich structure form and comprises an upper honeycomb board, a middle honeycomb board and a lower honeycomb board and the upper honeycomb board,the middle honeycomb board and the lower honeycomb board are connected together through backboard connecting pieces in different forms through bolts; electronic equipment in the board is arranged inmounting grooves arranged in the middle honeycomb board, wiring grooves are formed among the mounting grooves, and cables among the electronic equipment in the board are wired through the wiring grooves; the upper honeycomb board and the lower honeycomb board are connected with the middle honeycomb board in a glue joint mode; the electronic equipment in the board is made into an MCM multifunctional structure form or a single board PCB form, and all parts of the electronic equipment in the board are connected through power lines, cables and optical fibers. The electromechanical integrated intelligent backboard satellite framework eliminates a large-volume component, integrates subsystems such as data transmission and power distribution networks and the like, and embeds electronic equipmentinto a composite material to form the electromechanical integrated intelligent backboard. According to the invention, the satellite system is light in weight, simple to assemble and convenient and quick to test and debug.

Description

technical field [0001] The invention relates to aerospace, optics, machinery, electronics, information processing, etc., belongs to the practical technical field of satellite products, and in particular relates to a mechatronics intelligent backplane satellite architecture. Background technique [0002] In traditional spacecraft, the structural function, thermal control function and electronic function are independent design units; The functional units are assembled together with screws during the final assembly of the spacecraft. The power distribution and signal transmission between the units are realized through connectors and bundled cables. These cables and connectors are mainly composed of a large number of volume packages. They do not have electronic functions but It only provides structural support and allows debugging during assembly and testing; however, this design scheme is difficult to meet the development needs of future spacecraft for light weight, miniaturiza...

AI Technical Summary

Problems solved by technology

However, most of the existing technologies do not mention the use of the electronic control system in the smart backboard for circuit control, and there are smart backboards that

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