MEMS assembly

A shell and component technology, applied in the field of MEMS modules, can solve problems such as affecting the output signal and reducing the signal-to-noise ratio.
CN110225441AActive Publication Date: 2019-09-10INFINEON TECH AG
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
INFINEON TECH AG
Publication Date
2019-09-10

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Abstract

The present invention relates to an MEMS module (100). The MEMS assembly includes a housing having an internal volume (V), wherein the housing (130) has a sound opening to the internal volume (V), a MEMS component in the housing (130) adjacent to the sound opening (132), and a layer element (138) arranged at least regionally at a surface region (134-1, 136-1) of the housing (130) that faces the internal volume (V), wherein the layer element (138) includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.
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Description

technical field

[0001] Embodiments relate to a MEMS module or MEMS sensor and a method of manufacturing the same. In particular, embodiments relate to a MEMS module in the form of a MEMS acoustic transducer, such as a MEMS microphone, and having a multilayer housing structure. The housing structure is designed to at least reduce the penetration of thermal changes into the interior volume of the MEMS module due to dynamic temperature or thermal fluctuations in the environment of the MEMS module. According to an embodiment, the housing arrangement of the MEMS module is configured as a thermal low-pass filter arrangement. Background technique

[0002] A MEMS module generally comprises electronic components arranged on a substrate, for example a MEMS component (MEMS=Micro Electro Mechanical System), which is surrounded by a housing. The housing is designed to protect the MEMS module from the external environment, such as dust, dirt, moisture, etc. Some housings (encapsulation...

Claims

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