Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Micro-module data center

A data center and micro-module technology, applied in data centers, cooling/ventilation/heating transformation, electrical components, etc., can solve problems such as inability to directly reflect the ambient temperature, inability to realize integrated cabinet integration, and low structural matching , to achieve the effect of improving the utilization rate of the computer room, convenient and quick on-site layout, and avoiding gas mixed flow

Inactive Publication Date: 2019-09-20
ZHEJIANG SHIP ELECTRONICS TECH
View PDF6 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the current data center micro-modules are usually composed of cabinets, cold aisles, power distribution cabinets, air conditioners, and monitoring systems. The current data center micro-modules have low structural matching and are prone to errors. The background lights are ordinary background lights, which cannot be intuitively displayed. Reflect the ambient temperature
In addition, the air-conditioning external cooling and heating cycle design is adopted. When the micro-module performs cooling and heating cycles during operation, it is easy to cause mixed flow of gas, poor return air effect, low cooling efficiency, and high energy consumption, which cannot realize the integration of integrated cabinets.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Micro-module data center
  • Micro-module data center
  • Micro-module data center

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0036] This embodiment provides a micro-module data center, such as Figure 1 to Figure 5 As shown, this micro-module data center, this micro-module data center is suitable for application in the edge computing access layer of all walks of life, the data center area is less than 200m 2 scene. Mainly used in government, education, telecommunications, medical care, transportation, energy, finance, media assets, small and medium-sized enterprises and branches of large enterprises, etc. Subsystems such as tanks, etc.), refrigeration, power supply and distribution, intelligent management, gas fire protection, and integrated wiring, including:

[0037] An integrated cabinet 1 and at least one group of IT cabinets 2, the integrated cabinet and the IT cabinet are connected through a cabinet merging kit 3, and the integrated cabinet includes:

[0038] A cabinet body with a accommodating cavity, a front door body is arranged on the front side of the cabinet body, and a magnetic lock 2...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a micro-module data center used for solving the problem that an existing data center micro-module needs external circulation heat dissipation, and is low in refrigeration efficiency, large in occupied area and difficult to assemble; the micro-module data center disclosed in the invention comprises a comprehensive cabinet and at least one set of IT equipment cabinet; the comprehensive cabinet comprises a cabinet body with a containing cavity, a power supply assembly, a monitoring alarm assembly and an air conditioner; a front door body is arranged on the front side of the cabinet body, and a rear door body is arranged on the rear side of the cabinet body; a closed space is defined by the cabinet body, the front door body and rear door body; the air conditioner is arranged at the bottom of the containing cavity; a cold air channel is formed between the air conditioner and the front door body, and a hot air channel is formed between the air conditioner and the rear door body; the air conditioner can draw cold air from the air conditioner to the cold air channel, and can draw the hot air from the hot air channel to the air conditioner; and according to the micro-module data center, the isolation design of closing the cold and hot channels is adopted, so that gas mixing is avoided, the return air temperature is greatly improved, the refrigeration efficiency is improved while the PUE is reduced, the space is saved, and the rapid arrangement, the visual display and the intelligent management are achieved.

Description

technical field [0001] The invention relates to the technical field of a micro-module data center integrated frame system, in particular to a micro-module data center. Background technique [0002] Modular data center is a new generation of data center deployment form based on cloud computing. In order to cope with the development trend of servers such as cloud computing, virtualization, centralization, and high density, it adopts a modular design concept to minimize the impact of infrastructure on computer rooms. The coupling of the environment integrates subsystems such as power supply and distribution, cooling, cabinets, airflow containment, integrated wiring, and dynamic environment monitoring to improve the overall operational efficiency of the data center, and to achieve rapid deployment, flexible expansion, and green energy conservation. It can be divided into micro-module product MDC and container data center product CDC. Modular data center can meet the urgent needs...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K7/14
CPCH05K7/1488H05K7/20754H05K7/20818H05K7/20836
Inventor 赵韦华居承宗张忠贵孙凤军张定根
Owner ZHEJIANG SHIP ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products