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Photo-sensitive composition and method of forming pattern using the same

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problem that high-resolution exposure/development process cannot be fully realized

Active Publication Date: 2019-09-24
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] For example, although Korean Laid-Open Patent No. 2013-0021324 discloses a positive resist composition, the above-mentioned high-resolution exposure / development process cannot be fully realized by the above-mentioned composition.

Method used

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  • Photo-sensitive composition and method of forming pattern using the same
  • Photo-sensitive composition and method of forming pattern using the same
  • Photo-sensitive composition and method of forming pattern using the same

Examples

Experimental program
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Effect test

experiment example

[0105] The photosensitive resin compositions of Examples and Comparative Examples were filtered through a fluororesin filter to obtain resist solutions. The above resist solution was spin-coated on a glass plate sputtered with copper, and prebaked directly at 110° C. for 60 seconds on a heating plate to form a resist film with a thickness of 1.50 μm. For the above resist film, using an I-line stepper ("NSR-2005i9C", manufactured by Nikon Co., Ltd., NA=0.57, δ=0.60), while changing the exposure amount stepwise, The line and space pattern morphology is subjected to exposure processing. Thereafter, the above-mentioned sheet was post-exposure baked on a hot plate at 110° C. for 60 seconds, and then spin-on-immersion development was performed for 60 seconds using a 2.38% tetramethylammonium hydroxide aqueous solution. The effective sensitivity and resolution of the above exposure and development processes were evaluated as follows.

[0106] (1) Effective sensitivity

[0107] B...

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Abstract

The present invention provides a photo-sensitive resin composition and a method of forming a pattern by using the same. The photo-sensitive resin composition of examples of the present invention contains an alkali-soluble resin, a photosensitizer, a development enhancer including a dioxane-based compound, and a solvent. Sensitivity and resolution thereof can be improved through the action of the development enhancer.

Description

technical field [0001] The present invention relates to a photosensitive resin composition and a pattern forming method using the photosensitive resin composition. More specifically, it relates to a photosensitive resin composition containing a resin and a photosensitive component, and a pattern forming method using the photosensitive resin composition. Background technique [0002] For example, photosensitive resin compositions are used to form various photocurable insulating patterns such as photoresists, insulating films, protective films, black matrices, and columnar spacers of display devices or semiconductor elements. For example, inorganic insulating films such as silicon oxides and silicon nitrides have high dielectric constants, so there is an increasing demand for low-dielectric organic insulating films. To form the above-mentioned organic insulating films, the above-mentioned photosensitive resin composition can be used. [0003] The said photosensitive resin com...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/039G03F7/00
CPCG03F7/004G03F7/039G03F7/00G03F7/022G03F7/0226G03F7/032G03F7/09G03F7/20G03F7/26
Inventor 李殷相梁敦植宋寅珏
Owner DONGWOO FINE CHEM CO LTD