Femtosecond laser direct writing and DMD maskless photoetching integrated printing equipment

Abstract

The invention discloses femtosecond laser direct writing and DMD maskless photoetching integrated printing equipment, and belongs to the technical field of optics. The equipment comprises a motion platform, a DMD maskless photoetching system projection objective lens adjusting sleeve, a DMD maskless photoetching system projection objective lens, a femtosecond laser direct writing system microscope objective lens adjusting sleeve, a femtosecond laser direct writing system microscope objective lens, a sample holder, a three-dimensional precise controllable displacement platform, a femtosecond laser direct writing system and a DMD maskless photoetching system. The equipment has the characteristics of high DMD printing efficiency and low cost. Compared with the prior art, the equipment has the advantages of high resolution and high precision of femtosecond laser processing, can save processing time by more than 80% for millimeter-scale elements, and can realize processing of large and complex integrated structures including micro-optical components, biological scaffold structures, micro-fluidic chips and the like by using a variety of photosensitive materials.

Description

technical field [0001] The invention belongs to the field of optical technology, and in particular relates to an integrated device capable of processing micro-nano structures in a large area. Background technique [0002] Femtosecond laser direct writing is a processing technology that performs single-point scanning with a tightly focused femtosecond laser beam. Usually, a microscopic objective lens is used to focus the beam. The spot size at the focus is generally only a few microns. By moving the processed sample, microstructures with arbitrary patterns can be prepared. This technology is flexible and has high precision, which is far below the size limited by the diffraction limit. However, when preparing large-area microstructures, especially when the pattern structure is complex, the point-by-point scanning method takes a long time, resulting in low processing efficiency. At the same time, the cost of femtosecond lasers is also very high, so this method is very unfavora...

AI Technical Summary

Problems solved by technology

This technology is flexible and has high precision, far below the size limited by the diffraction limit. However, when preparing large-area microstructures, especially when the pattern structure is complex, the point-by-point scanning method takes a long time, resulting in low processing efficiency.

At the same time, the cost of femtosecond lasers is also very high, so this method is very unfavorable for mass production and industrial applications

The processing method of femtosecond laser shell scanning combined with secondary exposure proposed in the prior art saves time and improves processing efficiency, but this method is only applicable to solid photoresists. For most liquid photosensitive materials, The pressure difference between the internal and external liquid will cause the shell to collapse and the processing to fail

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