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Integrated protection method for surface of module after chip wire welding

An all-in-one, chip technology, which is applied in the manufacture of semiconductor devices, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as the failure of the surface protective layer, and achieve the effect of prolonging the service life and improving the anti-corrosion ability

Inactive Publication Date: 2019-10-01
广东禾木科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide an integrated protection method for the surface of the module after chip wire bonding to solve the problem of failure of the surface protection layer after bonding wire bonding in the prior art.

Method used

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  • Integrated protection method for surface of module after chip wire welding

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Depend on figure 1 As shown, a method for integrally protecting the surface of a module after chip bonding includes the following steps:

[0024] S1. Fix the chip 5 on the chip frame 2, then install the chip frame 2 on the welding machine, and install the bonding wire 1;

[0025] S2. Install the nozzle 3 on the welding machine, the nozzle 3 is connected to the injection device storing the protective material 4, so that the nozzle 3 sprays the protective material 4 after welding, and then starts the welding machine to weld the chip 5 through the bonding wire 1 On chip frame 2;

[0026] S3. After the chip 5 on the chip frame 2 is cooled, spray the protective material 4 onto the surface of the chip 5 through the nozzle 3 until the surface of the chip 5 is completely covered;

[0027] S4. After the protective material 4 on the surface of the chip 5 is cooled, the chip frame 2 is removed to complete the welding protection.

[0028] In this embodiment, at least one nozzle ...

Embodiment 2

[0031] Depend on figure 1 As shown, a method for integrally protecting the surface of a module after chip bonding includes the following steps:

[0032] S1. Fix the chip 5 on the chip frame 2, then install the chip frame 2 on the welding machine, and install the bonding wire 1;

[0033] S2. Install the nozzle 3 on the welding machine, the nozzle 3 is connected to the injection device storing the protective material 4, so that the nozzle 3 sprays the protective material 4 after welding, and then starts the welding machine to weld the chip 5 through the bonding wire 1 On chip frame 2;

[0034] S3. After the chip 5 on the chip frame 2 is cooled, spray the protective material 4 onto the surface of the chip 5 through the nozzle 3 until the surface of the chip 5 is completely covered;

[0035] S4. After the protective material 4 on the surface of the chip 5 is cooled, the chip frame 2 is removed to complete the welding protection.

[0036] In this embodiment, the nozzles 3 are fi...

Embodiment 3

[0039] In this embodiment, the protective material 4 is a solvent-free acrylic resin conformal paint; others are the same as in Embodiment 2.

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Abstract

The invention discloses an integrated protection method for the surface of a module after chip wire welding, which relates to the technical field of integrated circuit welding and solves the problem of failure of a surface protection layer after welding of a bonding wire in the prior art. The technical key points are as follows: S1, a chip frame is installed on a welding machine, and a bonding wire is installed; S2, a nozzle is installed on the welding machine, the nozzle is communicated with a spraying device storing a protective material, and the welding machine is started; S3, the protective material is sprayed onto the surface of a chip through the nozzle; and S4, after the protective material on the surface of the chip is cooled, the chip frame is removed to complete welding protection. The protective material is sprayed on the chip after welding to protect the welding points of the bonding wire, so that the welding points will not be exposed in air. Compared with the traditionalchip welding process, the method of the invention can improve the anti-corrosion ability of the surface interconnection lines of an integrated circuit and extend the service life of devices.

Description

technical field [0001] The invention relates to the technical field of integrated circuit welding, in particular to a method for integrally protecting the surface of a module after chip wire bonding. Background technique [0002] Bonding wire is one of the four basic raw materials for traditional integrated circuits, semiconductor discrete devices and LED light source device packaging products, and is an important welding lead between the chip and the bracket. More than 80% of the soldering of semiconductor components is connected by wire bonding. With the development of integrated circuits and semiconductor devices to high density, high integration and miniaturization, many fields such as military products, smart phones, unmanned vehicles, and the Internet of Things Semiconductor packaging technology, technology, and product quality requirements are getting higher and higher, and the quality of bonding wire determines the performance of microelectronic IC packaging products...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/56
CPCH01L24/85H01L21/56H01L2224/85909H01L2224/8592H01L2224/48465
Inventor 杨斌崔成强周章桥张昱杨冠南
Owner 广东禾木科技有限公司