Substrate and peeling method

A technology of substrates and flexible substrates, applied in photovoltaic power generation, electrical components, climate sustainability, etc., can solve problems such as limiting the effective improvement of stripping efficiency, high price of laser stripping equipment, and inability to effectively improve problems, so as to reduce the difficulty of stripping, The effect of improving the stripping efficiency and reducing the preparation cost

Active Publication Date: 2019-10-01
NANJING TECH CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the base material is closely attached to the substrate during the preparation process, a large amount of heat will be generated during the peeling process to cause damage to the device, thereby reducing the yield of the device during the preparation process.
At th

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0032] When using the substrate 10 to prepare flexible devices, the surface energy of the first surface 103a is reduced or the surface energy of the inner surface of the channel 101 is increased by means of surface treatment, that is, the surface energy of the first surface 103a is smaller than that of the inner surface of the channel 101. Surface energy, thereby reducing the affinity of the film layer (such as: sacrificial layer 20) and the first surface 103a, or increasing the affinity of the film layer (sacrifice layer 20) in the channel 101 and the inner surface of the channel 101, in the subsequent stripping of the electroluminescent device During the process, when the force between the film layer (sacrifice layer 20 ) and the inner surface of the hole 101 is broken, the film layer (sacrifice layer 20 ) can be quickly separated from the substrate 10 , thereby improving the stripping efficiency.

[0033] In the present invention, there is no special limitation on the above-...

Example Embodiment

[0059] Example 1

[0060] (1) Substrate specification selection: the size is 200*200*0.7mm, the surface energy of the first surface is 28mN / m, the first opening and the second opening are circular, the radius of the circle is 250μm, the first opening and the second opening The two openings are distributed axially symmetrically on the first surface and the second surface respectively, and the distribution density is 100 per square centimeter, and the line connecting the geometric centers of the first opening and the second opening pattern is perpendicular to the first surface.

[0061] (2) sacrificial layer is made: with the zinc oxide (ZnO) nanocrystal solution of coating 15wt% on above-mentioned substrate with slit coating equipment, the size of ZnO nanocrystal is 8nm, and solvent is amyl alcohol, and solution surface tension is 35mN / m, the thickness measured on the first surface after drying is 300 nm.

[0062] (3) Fabrication of the flexible substrate layer: a polyimide (...

Example Embodiment

[0065] Example 2

[0066] (1) Substrate specification selection: the size is 200*200*0.7mm, the surface energy of the first surface is 28mN / m, the first opening and the second opening are circular, the radius of the circle is 100μm, the first opening and the second opening The two openings are distributed axially symmetrically on the first surface and the second surface respectively, and the distribution density is 500 per square centimeter, and the line connecting the geometric centers of the first opening and the second opening pattern is perpendicular to the first surface.

[0067] (2) The preparation method of the sacrificial layer is the same as the step (2) of embodiment 1.

[0068] (3) The manufacturing method of the flexible substrate layer is the same as the step (3) of Embodiment 1.

[0069] (4) The device manufacturing method is the same as step (4) of embodiment 1.

[0070] (5) The device stripping method is the same as step (5) of embodiment 1.

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Abstract

The invention provides a substrate and a preparation method of a flexible light-emitting electroluminescent device. The substrate includes a first surface and a second surface opposite to the first surface. The first surface is provided with a plurality of first openings, the second surface is provided with a plurality of second openings, the first surface is used for carrying a film layer, the plurality of first openings and the plurality of second openings are in one-to-one correspondence and communicate with each other to form a plurality of hole channels, the surface energy of the first surface and the surface energy of the film layer are both smaller than the surface energy of inner surfaces of the hole channels, and the deviation of the surface energy of the film layer from the surface energy of the first surface is within +/-10%. By changing the surface performance of the substrate surfaces and the inner surfaces of the substrate hole channels, the rapid peeling of a flexible device and the substrate is achieved, and the peeling efficiency is improved. At the same time, the device and the substrate can be separated under the condition that the device is not mechanically damaged through the acting force of the etching medium destroying a sacrificial layer material and substrate contact interface, the stripping and preparation of the flexible device are completed, and thepreparation yield of the flexible device is improved.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a method for preparing a substrate and a flexible electroluminescent device. Background technique [0002] The emergence of wearable electronic devices has brought great changes to people's lives and perceptions, mainly because wearable electronic devices can bring users a more perfect experience than traditional electronic devices. At the same time, the wearability of wearable electronic devices requires that the relevant electronic devices have good flexibility. Therefore, research on the preparation of flexible devices has attracted much attention in recent years. [0003] The preparation process of a general flexible device mainly includes the following steps: first, the flexible material is fabricated on a rigid substrate to form a flexible base layer; The device was peeled off from the substrate to obtain a flexible electroluminescent device. At present, the most widely...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L51/56
CPCH10K71/80H10K77/111H10K50/841H10K71/00Y02P70/50
Inventor 顾辛艳
Owner NANJING TECH CORP LTD
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