A semiconductor silicon rod cutting device based on wire cutting
A wire cutting and semiconductor technology, applied in the field of semiconductor silicon rod cutting equipment based on wire cutting, can solve problems such as inability to effectively fix silicon rods, chipping of silicon rods, and affecting cutting quality, so as to improve processing quality, reduce chipping, The effect of improving the truncation quality
Active Publication Date: 2021-06-22
蔡欧
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Problems solved by technology
[0003] Technical problem: At present, the jig of the silicon rod cutting equipment cannot effectively fix the silicon rod, resulting in a slight displacement of the silicon rod surface at the moment the silicon rod is cut off, resulting in the phenomenon of "edge collapse", which seriously affects the cutting quality
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[0019] Combine below Figure 1-Figure 6 The present invention is described in detail, and for convenience of description, the orientations mentioned below are now stipulated as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.
[0020] The present invention relates to a semiconductor silicon ingot cutting device based on wire cutting, which is mainly used in cutting semiconductor silicon rods based on wire cutting. The present invention will be further described below in conjunction with the accompanying drawings of the present invention:
[0021] A semiconductor silicon rod cutting device based on wire cutting according to the present invention includes a machine base 11, which is provided with a transfer chamber 12 with an opening facing upwards, and is provided in the transfer chamber 12 for conveying silicon rods. And move the silicon rod to the feeding device 101 at the designated working position. ...
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A semiconductor silicon rod cutting device based on wire cutting disclosed in the present invention includes a machine base, a transfer chamber with an opening facing upwards is provided in the transfer chamber, a feeding device is provided in the transfer chamber, and a feeding device can be installed on the feeding device. There are no less than two clamps, the base is provided with a feeding device located on the left side of the feeding device, the feeding device is provided with a wire cutting device, and the base is provided with a feeding device located on the left side of the feeding device. The transmission device on the left side of the device, the silicon rod clamp of the present invention can automatically clamp the silicon rod through the wedge block and the clamping claw, and the clamping claw and the wedge block are fixedly connected to the elastic rubber block on both, so that the two ends of the silicon rod All can be completely fixed by the silicon rod clamp, thereby effectively avoiding the "chipping" phenomenon when the silicon rod is cut off caused by over-positioning or under-positioning, and improving the cutting quality. Therefore, the present invention can effectively clamp and fix the silicon rod, thereby reducing silicon rod The phenomenon of "edge chipping" when the rod is cut off improves the processing quality of the cut surface of the silicon rod.
Description
technical field [0001] The invention relates to the technical field of cutting semiconductor silicon rods, in particular to wire cutting-based semiconductor silicon rod cutting equipment. Background technique [0002] The method of producing monocrystalline silicon is usually to grow rod-shaped monocrystalline silicon from the melt by Czochralski method or suspension zone melting method. The cross section of monocrystalline silicon is circular. The first process is cutting. The purpose of cutting is to cut off the head and tail of the monocrystalline silicon rod and the parts that do not meet the specifications required by the customer, segment the monocrystalline silicon rod into lengths that the slicing equipment can handle, and cut the test piece to measure the single crystal. The resistivity, oxygen content, minority carrier life and other quality parameters of silicon rods. The current monocrystalline silicon rod cutting machines mainly include diamond band saw cutting ...
Claims
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IPC IPC(8): B28D5/00B28D5/04
CPCB28D5/0058B28D5/0082B28D5/045
Inventor 陈惠丽
Owner 蔡欧