Semiconductor device
A semiconductor and chip technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as increased heat loss of semiconductor devices
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no. 1 Embodiment approach
[0029] figure 1 (a) is a bottom view illustrating the semiconductor device of the present embodiment. figure 1 (b) is figure 1 The cross-sectional view at line AA of (a).
[0030] Such as figure 1 (a) and figure 1 As shown in (b), the semiconductor device 10 of this embodiment includes a semiconductor chip 11 , a heat sink 12 , and a sealing resin 18 . The semiconductor device 10 further includes a dummy chip 13 , a bonding member 14 , a substrate 15 , bonding wires 16 , and connection terminals 17 . The semiconductor device 10 of this example is a BGA (Ball Grid Array) package with a heat sink. As a package with a heat sink, it is not limited to BGA, and can also be applied to LGA (Land Grid Array, flat grid array), SOP (Small Outline Package, small outline package), QFP (Quad Flat Package, square flat package) ), QFN (Quad For Non-lead package, square leadless package), DFN (Dual For Non-leadpackage, double-lead package), etc.
[0031] Hereinafter, a plane including t...
no. 2 Embodiment approach
[0062] In the case of connecting a semiconductor chip to a die liner, heat dissipation performance can be improved by using a metal fiber sheet impregnated with a thermosetting resin instead of using a bonding member such as Ag paste between the semiconductor chip and the die liner .
[0063] Figure 4 exemplifies the semiconductor device of this embodiment and corresponds to figure 1 A cross-sectional view at the position of the AA line in (a).
[0064] Such as Figure 4 As shown in , the semiconductor device 210 of this embodiment includes a semiconductor chip 11, a bonding member 214, and a mold liner 15a. The bonding member 214 is provided between the semiconductor chip 11 and the mold pad 15a. The semiconductor chip 11 is connected to the die pad 15 a via the bonding member 214 on the back surface (second surface) 11 b.
[0065] The joining member 214 comprises a metal fiber sheet. The metal fiber sheet is impregnated with a thermosetting resin. The metal fiber she...
no. 3 Embodiment approach
[0113] The metal fiber sheet impregnated with a thermosetting resin may be formed into a lead frame shape and used as a die liner or a connection terminal.
[0114] Figure 11 (a) is equivalent to the semiconductor device of this embodiment figure 1 A cross-sectional view at the position of the AA line in (a). Figure 11(b) is equivalent to the semiconductor device of the comparative example figure 1 A cross-sectional view at the position of the AA line in (a).
[0115] Such as Figure 11 As shown in (a), the semiconductor device 310 includes a semiconductor chip 11 and a mold liner 315 . The semiconductor chip 11 is attached to the mold pad 315 . The die liner 315 is formed by cutting a lead frame cut from a metal sheet impregnated with a thermosetting resin together with the connection terminal 317 .
[0116] Since the mold liner 315 contains metal fibers, it has low thermal resistance. By adjusting the thickness of the mold liner 315, the desired low thermal resistan...
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Abstract
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