LED (Light-emitting Diode) encapsulating method
A technology of LED packaging and LED chips, which is applied in the field of lighting, can solve the problems of decreased brightness of the whole lamp, reduced excitation efficiency, etc., and achieves the effect of good light distribution
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Embodiment 2
[0074] The LED encapsulation method provided in this embodiment is substantially the same as the method provided in Embodiment 1, the difference is that in this embodiment, the formation of the second packaging adhesive layer 40 in step A3 specifically includes steps: A31, in The surface of the first packaging adhesive layer 30 is coated with the fluorescent adhesive layer of the lower structure 41 ; A32 , the surface of the fluorescent adhesive layer of the lower structure 41 is coated with the transparent silicone layer of the upper structure 42 . In this embodiment, the layered structure of the second encapsulation adhesive layer 40 can also be realized by layering.
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