LED (Light-emitting Diode) encapsulating method
A technology of LED packaging and LED chips, which is applied in the field of lighting, can solve the problems of decreased brightness of the whole lamp, reduced excitation efficiency, etc., and achieves the effect of good light distribution
Inactive Publication Date: 2019-10-11
厦门多彩光电子科技有限公司
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- Application Information
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Problems solved by technology
As the temperature of the fluorescent powder increases, the excitation efficiency decreases, so that the brightness of the whole lamp decreases when the heat is stable.
Method used
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Embodiment 2
[0074] The LED encapsulation method provided in this embodiment is substantially the same as the method provided in Embodiment 1, the difference is that in this embodiment, the formation of the second packaging adhesive layer 40 in step A3 specifically includes steps: A31, in The surface of the first packaging adhesive layer 30 is coated with the fluorescent adhesive layer of the lower structure 41 ; A32 , the surface of the fluorescent adhesive layer of the lower structure 41 is coated with the transparent silicone layer of the upper structure 42 . In this embodiment, the layered structure of the second encapsulation adhesive layer 40 can also be realized by layering.
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Abstract
The invention provides an LED encapsulating method. The method comprises the steps of: A1, providing an encapsulation bracket for fixing and encapsulating the LED chip on the encapsulation bracket; A2, pasting a first encapsulation adhesive layer, which covers the light outputting surface and the side face of the LED chip and is a silicon dioxide-silica gel composite layer; A3, pasting a second encapsulation adhesive layer on the surface of the first encapsulation adhesive layer, which includes an lower layer structure and an upper layer structure; and A4, pasting a third encapsulation adhesive layer on the upper layer structure of the second encapsulation adhesive layer. The lower layer structure is a fluorescent adhesive layer; the upper layer structure is a transparent silica gel layer;and the third encapsulation adhesive layer is a fluorescent adhesive layer. By adoption of the LED lamp bead prepared by the method, the whole light outputting effect and light outputting amount arebetter improved.
Description
technical field [0001] The invention relates to the lighting field, in particular to an LED packaging method. Background technique [0002] Light-emitting diodes, referred to as LEDs for short, refer to semiconductor diodes made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), etc., which can convert electrical energy into light energy. For the application in the field of lighting, it is necessary to package the LED chip into an LED package first, and then apply the LED package to different lamps and lanterns. The large heat generation of LED is a major problem that has not been overcome in the prior art. [0003] In the LED lamp bead, it generally includes the packaging bracket, the LED chip solidly sealed on the packaging bracket, and the fluorescent glue covering the LED chip. Because the LED chip is isolated and sealed, the heat transfer method of the LED chip is mainly heat conduction and heat transfer. Radiation, conventional LED lamp...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H01L33/56H01L33/64H01L33/50H01L33/58
CPCH01L33/507H01L33/56H01L33/58H01L33/641H01L2933/0041H01L2933/005H01L2933/0058H01L2933/0075
Inventor 高春瑞
Owner 厦门多彩光电子科技有限公司