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A self-adaptive mold repair process optimization method and device

A process optimization and self-adaptive technology, applied in the direction of metal material coating process, manufacturing tools, other manufacturing equipment/tools, etc., can solve the problem of difficult repair of molds and cannot meet the requirements of use, and achieve accurate repair quality, simple methods, The effect of saving repair costs

Inactive Publication Date: 2020-05-19
HUANGSHAN UNIV +3
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Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing mold repair is too difficult to meet the requirements of use, and to invent an adaptive mold repair process optimization method and device. The laser cladding process parameters and sequence are the best for repairing, which friction stir processing process parameters and sequence are the best for modifying the repair layer, and at the same time, the influence of electrolytic grinding process parameters on the grinding performance of the modified repair layer is analyzed. Optimizing the Best Electrolytic Grinding Process Parameters

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  • A self-adaptive mold repair process optimization method and device
  • A self-adaptive mold repair process optimization method and device
  • A self-adaptive mold repair process optimization method and device

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Embodiment 1

[0033] Such as figure 1 shown.

[0034] A method for optimizing an adaptive mold repair process, which method includes the following steps:

[0035] Step 1: According to certain rules, establish a mold repair shape library, such as cuboid, ellipsoid, semicircle, nearly semicircle, conical frustum and other shape structures;

[0036] Step 2: For the same shape, select different laser cladding process parameters and different cladding sequences for surface repair, and comprehensively analyze different process parameters from the aspects of residual stress distribution, deformation, wear resistance and corrosion resistance, etc. and the order of influence on the repair layer, and summarize the results one by one, and establish a corresponding database for subsequent calls;

[0037] Step 3: For the same shape, analyze the friction stir processing process parameters and sequence on the basis of different process parameters and processing sequences to modify the repaired layer tha...

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Abstract

The invention provides a self-adaptive die repair process optimizing method and device. The self-adaptive die repair process optimizing method and device are characterized in that the device comprisesa workbench (2), a camera (1) and a computer (4); the workbench (2) is used for mounting a to-be-repaired die (3); the camera is mounted above the workbench and used for shooting the shape of the to-be-repaired position of the die mounted on the workbench and feeding the shape into the computer (4) connected with the camera; and a repair shape body map depot, laser cladding process parameter anddifferent-cladding-sequence databases, stirring friction processing process parameter and sequence databases, electrolytic grinding databases and corresponding fuzzy control models are stored in the computer (4), so that proper repair process parameters are conveniently determined. A process optimization scheme can be obtained through analysis and research and provides reference for practical engineering application.

Description

technical field [0001] The invention relates to a mechanical repair technology, in particular to a mold repair technology, in particular to an adaptive mold repair process optimization method and device. The present invention mainly studies different mold repairing shapes based on the performance of the repairing position, which laser cladding process parameters and sequence are the best for repairing, and which friction stir processing process parameters and sequence are the best for modifying the repair layer. At the same time, the analysis The influence of electrolytic grinding process parameters on the grinding performance of the modified repair layer, and optimize the best electrolytic grinding process parameters. Through the above analysis and research, the process optimization scheme can be obtained to provide the basis for practical engineering application. [0002] technical background [0003] Mold repair is a very complicated process. Simple repair is difficult to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23P6/00B23H5/08B23P23/00C23C24/10
CPCB23H5/08B23P6/00B23P23/00C23C24/10
Inventor 汪洪峰郭魂刘胜荣宋娓娓王宏宇何亚峰储杰朱卫华葛小乐戴晟庞军蒲家飞董旗姜迪徐吉
Owner HUANGSHAN UNIV