Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Bubble control micro-ultrasonic sphere emission profiling array polishing method and device

A technology of grinding and polishing spheres, which is applied in the field of bubble-controlled micro-ultrasonic sphere emission profiling array grinding and polishing, can solve the problems of low shape accuracy, low processing efficiency, fast wear and so on, to ensure shape consistency, improve processing efficiency, surface The effect of low roughness

Active Publication Date: 2021-02-19
ZHEJIANG UNIV OF TECH
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] So far, these reported processing methods are still unable to meet the processing accuracy and processing efficiency requirements for silicon carbide micro-hemispherical dies
The main reasons are: (1) When the micro-hemispherical die is processed by micro-cutting, the bottom or top of the micro-hemisphere may crack, and the surface and sub-surface may be damaged during the brittle removal process, which cannot meet the requirements of machining accuracy.
Processing efficiency and yield cannot be guaranteed
(2) Micro-ultrasonic layered machining, because the micro-tools will wear out, and the wear cannot be predicted and controlled, so it is difficult to plan the layered feed path, resulting in poor shape accuracy of the micro-hemisphere and low processing efficiency
(3) The micro-hemispherical concave mold array of micro-EDM has a small space, so the precision of the processing equipment is very high, and the electrode with high shape precision is difficult to process, and it wears quickly during the processing, and the processed micro The surface quality of the hemispherical die is poor and the shape accuracy is low
So far, there has been no report on the development of a micro-hemispherical die array that meets the processing accuracy and quality requirements.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bubble control micro-ultrasonic sphere emission profiling array polishing method and device
  • Bubble control micro-ultrasonic sphere emission profiling array polishing method and device
  • Bubble control micro-ultrasonic sphere emission profiling array polishing method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The specific embodiment of the specific solution of the present invention will be further elaborated in conjunction with the accompanying drawings.

[0026] refer to Figure 1 to Figure 5 , a bubble control micro-ultrasonic sphere emission profiling array polishing method and device, the polishing method includes the following steps:

[0027] Make grinding and polishing mold 9: described grinding and polishing mold 9 comprises tool connecting rod shown in the figure, hard material coating 93 (this example adopts hard diamond coating), ball mold guide plate 96 (illustration is partly covered Split ball mold guide plate) and spheroid 95. The tool connecting rod includes a horn 91 at the upper end and a tool head 92 at the lower end, the upper end of the horn 91 is connected with the micro ultrasonic vibration device 10, and the tool head 92 is plated with a hard material with a thickness of 5 mm The coating 93 is made of aluminum oxide material in this example, and the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a bubble regulating micro-ultrasonic sphere launching copying array polishing method and a bubble regulating micro-ultrasonic sphere launching copying array polishing device. The high-frequency percussion of nanoscale abrasive particles in spheres and a polishing liquid to the surface of a silicon carbide to-be-processed workpiece is excited by vibration of a micro-ultrasonic polishing mold, so that a material is removed. According to the method and the device, the processing efficiency of a micro-spherical die array is improved greatly, and the consistence of shape ofthe dies is guaranteed by way of bubble modulation.

Description

technical field [0001] The invention relates to the field of ultra-precision machining, in particular to a method and device for micro-ultrasonic sphere emission profiling array lapping and polishing by air bubble regulation. Background technique [0002] Hemispherical resonant gyroscope is a new type of inertial sensor, which has the characteristics of high precision, strong stability, high reliability and long life, and has good resistance to shock and vibration and good temperature performance. It has been used in aviation, weapons and other fields began to be used. However, the processing accuracy of the spherical shell of this gyroscope is low, the main reason is that the processing accuracy of the parent body—the hemispherical die array is poor. The die material has high hardness, small size and difficult processing. There are existing processing methods for the die, such as micro-cutting, micro-ultrasonic layered machining, and micro-electric discharge machining. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/04
CPCB24B1/04
Inventor 赵军吕经国黄金锋王睿
Owner ZHEJIANG UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com