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Electroplating clamp

A technology of electroplating fixtures and fixtures, which is applied in the direction of circuits, electrolytic processes, electrolytic components, etc., can solve the problems of cumbersome, complex structures, waste, etc., and achieve the effects of simple structure, improved assembly efficiency, and convenient assembly

Inactive Publication Date: 2019-10-22
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing electroplating jigs are often complex in structure, or different electroplating jigs need to be selected according to the shape of the wafer, the quality requirements of the coating and the size of the electroplating equipment
In the field of semiconductor chip manufacturing, it is usually necessary to replace different electroplating fixtures for the electroplating of wafers of different shapes and sizes, resulting in great tediousness and waste

Method used

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  • Electroplating clamp
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Embodiment Construction

[0029] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0030] It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values ​​may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values ​​within acceptable error margins or design constraints. The directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the dire...

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PUM

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Abstract

The invention provides an electroplating clamp. The electroplating clamp comprises a front cover and a rear cover, wherein the front cover comprises a top side, a peripheral side, a bottom side and athrough opening, a first fixing groove and a second fixing groove are sequentially formed in the peripheral side of the front cover in the thickness direction of the front cover, the first fixing groove, the second fixing groove and the through opening extend from the top side of the front cover to the bottom side, the first fixing groove is used for containing a clamping object of the clamp, andthe second fixing groove is used for containing a metal electrode. According to the electroplating clamp, wafers of various sizes and shapes can be supported, the problem of consistency of clamping ofthe semiconductor wafers is solved, the uniformity of the coating metal is ensured, and the assembly efficiency of semiconductor wafer electroplating is improved.

Description

technical field [0001] The present disclosure relates to the technical field of semiconductor chip manufacturing, in particular to an electroplating jig. Background technique [0002] Electroplating is a technology that uses the principle of an electrolytic cell to deposit a metal coating with good adhesion but different properties from the material to be plated on the material to be plated. Semiconductor devices need to improve the electrical conductivity, thermal conductivity, corrosion resistance and oxidation resistance of the semiconductor material itself by coating a single metal film or alloy film on the surface. When electroplating a semiconductor wafer, since the wafer itself is fragile and not easy to fix, it is necessary to use an electroplating fixture to fix the material to be plated during the electroplating process, thereby completing the electroplating process on the wafer. Existing electroplating jigs often have complex structures, or different electroplati...

Claims

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Application Information

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IPC IPC(8): C25D17/08C25D7/12
CPCC25D7/12C25D17/001C25D17/08
Inventor 刘素平曼玉选王鑫李伟马骁宇
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI