A kind of compact bandpass filter based on lcp in ku band

Abstract

The invention discloses a Ku-band compact bandpass filter based on LCP, which includes an LCP base material, a first microstrip line is arranged on the LCP base material, and one end of the first microstrip line is formed with a Two first branches, the other end of the first microstrip line is formed with two second branches, the two ends of the first microstrip line are respectively formed with second microstrip lines, and the second microstrip line A third branch and a third microstrip line are formed at the end of the line, and a CPWG input port and a CPWG output port are respectively provided at the ends of the two third microstrip lines. The invention increases the bandwidth by means of branch loading, further improves the selectivity of the passband, ensures the strong coupling of the broadband, reduces the coupling loss, and has the characteristics of flexibility and bendability, and is suitable for use in small-volume electronic products.

Description

technical field [0001] The invention relates to a band-pass filter, in particular to an LCP-based Ku-band compact band-pass filter. Background technique [0002] In the prior art, the research and development of the band-pass filter is the basis of the design of the RF front-end transceiver module. The RF receiver is used to detect the required weak signal from the harsh real environment, because the power of the interference signal may be much greater than the required signal Power, which requires the receiver to have good selectivity, and the bandpass filter plays the role of channel selection. [0003] At present, in electronic products with very small volume, the manufacturing technology of using flexible circuits to connect different electronic units or modules has reached a high level of maturity. Flexible electronic technology provides reliable connections between printed boards in a bent state. Electronic products with demanding volume, thickness, and weight require...

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Problems solved by technology

Although the size and loss of the hairpin line structure are improved to a certain extent compared with the parallel coupled line structure, when calculating the odd and even mode impedance of the first few orders, it is still found that there is a large gap between the odd and even mode impedance, resulting in the The spacing is too small to meet the processing requirements

The above-mentioned process requirements cannot be met. The main reason is that the LCP process adopts the printed board manufacturing process, in which the minimum line width can only reach 100 μm, the line spacing is 150 μm, the aperture diameter of the through hole is 200 μm, and the aperture diameter of the blind buried hole is 300 μm. Sputtering process or photolithography process compared

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