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Creep-resistant solder paste and preparation device

A technology for preparing equipment and solder paste, which is applied in the direction of manufacturing tools, solid separation, filtering, etc., and can solve the problems of easy frostbite effect, difficult to remove impurities, and bad

Inactive Publication Date: 2019-10-25
东阳奕品新能源有限公司
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  • Application Information

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Problems solved by technology

It is mainly used for the welding of electronic components such as PCB surface resistance, capacitor and IC in the SMT industry. With the increase in the use of solder paste, the types of anti-creep also increase. Among them, the use of anti-creep solder paste is particularly extensive. At present, anti-creep When preparing solder paste, it is difficult to remove the impurities in the raw materials of the solder paste. At the same time, due to the looseness of the raw materials of the solder paste, extrusion molding is generally required before the preparation, which is easy to frostbite and the effect is not good. In view of the above disadvantages, a A kind of anti-creep solder paste and preparation device

Method used

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  • Creep-resistant solder paste and preparation device
  • Creep-resistant solder paste and preparation device

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Embodiment Construction

[0016] All features disclosed in this specification, or steps in all methods or processes disclosed, may be combined in any manner, except for mutually exclusive features and / or steps.

[0017] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless expressly stated otherwise, may be replaced by alternative features which are equivalent or serve a similar purpose. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0018] Such as Figure 1-3 As shown, a creep-resistant solder paste and preparation device of the device of the present invention includes a solder paste raw material processing box 10 and a filter chamber 13 arranged in the solder paste raw material processing box 10, and also includes a filter chamber 13 arranged on the lower side The pusher mechanism of the solder paste raw material processing box 10 is provided with a die transmission cha...

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Abstract

The invention discloses a creep-resistant solder paste and a preparation device. The preparation device comprises a solder paste raw material processing box and a filtering cavity formed in the solderpaste raw material processing box, and further comprises a pushing mechanism arranged on the lower side of the filtering cavity; a pressing die transmission cavity is formed in the solder paste raw material processing box; and a round pressing mechanism is arranged in the pressing die transmission cavity. The preparation device has the advantages of being simple in mechanism and simple and convenient to use, raw materials of the solder paste can be processed, preparation is facilitated, the raw materials of the solder paste can be filtered, for the filtered raw materials of the solder paste,large pieces of garbage such as stones in the raw materials of the solder paste are filtered out, after filtering is finished, pressing is carried out, the round solder paste raw materials can be pressed and prepared, the use is convenient, so that the purity of the raw materials of the solder paste is guaranteed, meanwhile, the device can also press the raw materials of the solder paste, more solder paste raw material processing modes are provided for a user, so that the utilization rate of the raw materials of the solder paste is increased.

Description

technical field [0001] The invention relates to the technical field of solder paste raw material processing, in particular to a creep-resistant solder paste and a preparation device. Background technique [0002] Solder paste is a new type of soldering material that emerged with SMT. It is a paste mixture formed by mixing solder powder, flux, and other surfactants and thixotropic agents. It is mainly used for the welding of electronic components such as PCB surface resistance, capacitor and IC in the SMT industry. With the increase in the use of solder paste, the types of creep resistance also increase. Among them, the use of creep-resistant solder paste is particularly extensive. At present, anti-creep When preparing solder paste, it is difficult to remove the impurities in the raw materials of the solder paste. At the same time, due to the looseness of the raw materials of the solder paste, extrusion molding is generally required before the preparation, which is easy to fr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B30B11/04B30B15/00B30B15/30B30B15/32B07B1/28B07B1/42B07B1/46
CPCB07B1/28B07B1/42B07B1/46B30B11/04B30B15/00B30B15/302B30B15/32
Inventor 尹卫东郭国梓
Owner 东阳奕品新能源有限公司
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