Tunneling field effect transistor, manufacturing method thereof, and chip
A tunneling field effect and substrate-based technology, which is applied in semiconductor/solid-state device manufacturing, diodes, semiconductor devices, etc., can solve the problems of inability to manufacture large-scale TFETs, and achieve cost advantages, small corrections, and high process compatibility.
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[0045] In order to make the purpose, technical solution and advantages of the present application clearer, the implementation manners of the present application will be further described in detail below in conjunction with the accompanying drawings.
[0046] With the development of semiconductor technology, TFET is more and more favored by people because of its smaller SS. Chips made with TFETs tend to consume less power.
[0047] figure 1 A schematic structural diagram of a TFET provided for an embodiment of the present invention, such as figure 1 As shown, the TFET 0 includes an active layer 01, and a gate region 02, a source electrode 03, and a drain electrode 04 disposed on the active layer 01, and the gate region 02 generally includes: a gate dielectric layer that is sequentially away from the active layer 01 021, a work function layer 022 and a gate electrode 023.
[0048] The active layer 01 can be made of a substrate of semiconductor material, the active layer 01 in...
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