System-in-package thermal reliability comprehensive optimization design method

Abstract

The invention discloses a system-in-package thermal reliability comprehensive optimization design method. The method belongs to the technical field of system-in-package, and is characterized by comprising the following steps: establishing a system-in-package structure model, selecting factors and levels influencing warping to establish a combined test table, analyzing by taking structure warping as a response, and utilizing screening factor combinations of a Taguchi method larger-the -better characteristics to ensure the thermal reliability of the structure warping; combining the factors included in the screening result influencing warping with the sizes of the micro-bumps, establishing a new combination test table, analyzing, taking the thermal stress of the micro-bumps as a response, obtaining an optimal combination structure by using a Taguchi method smaller-the-better characteristic, and completing the comprehensive optimization design of the system-in-package thermal reliability.The warping of the system-in-package structure is taken as a reference, on the premise of ensuring the warping reliability, the thermal reliability of the micro-bumps of the system-in-package structure is optimized and analyzed by utilizing the minimization characteristic of the Taguchi method, a final optimized structure is obtained, and the thermal reliability of the system-in-package structureis improved.

Description

technical field [0001] The invention belongs to the technical field of system-level packaging, and in particular relates to a comprehensive optimization design method for thermal reliability of system-level packaging. Background technique [0002] System-in-package technology is one of the mainstream process technologies in the post-Moore's Law era. It has the characteristics of high performance, multi-function and high density, and has significant advantages and great application prospects in military, aerospace, medical, consumer electronics and other fields. , but the complex process structure of system-in-package also brings huge reliability challenges, among which the problem of system-in-package failure caused by thermal stress is more prominent. During the production process of the system-in-package structure, it will experience a huge temperature difference change. The system-in-package structure contains a variety of different materials. When the temperature changes...

AI Technical Summary

Problems solved by technology

In addition, in the reliability research of the system-level package structure, the fatigue creep failure of the micro-bump is the main cause of the failure. During the service process of the package structure, under the effect of periodic temperature load, the Under the interaction of thermal fatigue and creep of the point, the micro-bump produces a stress-strain concentration area, which leads to cracks, and finally leads to the complete failure of the micro-bump

[0003]At present, the two major issues of warpage caused by heat in the system-in-package structure and the reliability of micro-bumps have been studied individually, but in the actual process And the application process of the product often needs to consider these two major issues at the same time

At present, there are few technologies that consider both the warpage problem of the system-in-package structure and the reliability problem of micro-bumps. The main reason is that when conducting structural optimization design research for multiple failure problems, it is necessary to consider the interaction of some correlation factors at the same time.

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