System-in-package thermal reliability comprehensive optimization design method

Abstract

The invention discloses a system-in-package thermal reliability comprehensive optimization design method. The method belongs to the technical field of system-in-package, and is characterized by comprising the following steps: establishing a system-in-package structure model, selecting factors and levels influencing warping to establish a combined test table, analyzing by taking structure warping as a response, and utilizing screening factor combinations of a Taguchi method larger-the -better characteristics to ensure the thermal reliability of the structure warping; combining the factors included in the screening result influencing warping with the sizes of the micro-bumps, establishing a new combination test table, analyzing, taking the thermal stress of the micro-bumps as a response, obtaining an optimal combination structure by using a Taguchi method smaller-the-better characteristic, and completing the comprehensive optimization design of the system-in-package thermal reliability.The warping of the system-in-package structure is taken as a reference, on the premise of ensuring the warping reliability, the thermal reliability of the micro-bumps of the system-in-package structure is optimized and analyzed by utilizing the minimization characteristic of the Taguchi method, a final optimized structure is obtained, and the thermal reliability of the system-in-package structureis improved.

Description

technical field

[0001] The invention belongs to the technical field of system-level packaging, and in particular relates to a comprehensive optimization design method for thermal reliability of system-level packaging. Background technique

[0002] System-in-package technology is one of the mainstream process technologies in the post-Moore's Law era. It has the characteristics of high performance, multi-function and high density, and has significant advantages and great application prospects in military, aerospace, medical, consumer electronics and other fields. , but the complex process structure of system-in-package also brings huge reliability challenges, among which the problem of system-in-package failure caused by thermal stress is more prominent. During the production process of the system-in-package structure, it will experience a huge temperature difference change. The system-in-package structure contains a variety of different materials. When the temperature changes...

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