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Positive type photoresist composition, pattern manufactured therefrom, and method for manufacturing pattern

A technology of photoresist and composition, which is applied in the direction of photosensitive materials, optics, and photomechanical equipment used in photomechanical equipment, and can solve the problems of reduced thermal stability of photoresist compositions, raised impurities, Resin incompatibility and other issues

Active Publication Date: 2019-11-15
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since these compounds are low-molecular substances, there are problems that the thermal stability of the photoresist composition containing them decreases and they are not compatible with resins.
In addition, there is a problem that the plating resistance is poor during plating using the composition, and thus impurities are formed on the bumps

Method used

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  • Positive type photoresist composition, pattern manufactured therefrom, and method for manufacturing pattern
  • Positive type photoresist composition, pattern manufactured therefrom, and method for manufacturing pattern
  • Positive type photoresist composition, pattern manufactured therefrom, and method for manufacturing pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0153] 40 g of m-, p-cresol novolac resin (Mw: 12000, ADR) represented by the following chemical formula 6 as a binder resin / sec), 50 g of an acrylic resin represented by the following chemical formula 8 (Mw: 65000), 10 g of an oligomer compound of the following chemical formula 9 having a functional group protected by an acetal group as an oligomer compound (Mw: 1500) , 3g of N-(trifluoromethylsulfonyloxy)-1,8-naphthalimide as a photoacid generator and 0.1g of trihydroxyethylamine as a quencher were mixed, and then at room temperature Stir to make a homogeneous solution. Thus, a positive photoresist composition was produced.

[0154] [chemical formula 6]

[0155]

[0156] [chemical formula 8]

[0157]

[0158] [chemical formula 9]

[0159]

Embodiment 2

[0161] A positive photoresist composition was produced in the same manner as in Example 1 except that an oligomer compound (Mw: 2500) represented by Chemical Formula 11 was used as a dissolution inhibitor.

[0162] [chemical formula 11]

[0163]

Embodiment 3

[0165] A positive photoresist composition was produced in the same manner as in Example 1, except that 10 g of m-,p-cresol novolac resin (Mw: 12000, ADR / sec), 30 g of acetal-protected polyhydroxystyrene resin represented by the following chemical formula 7 (Mw: 15300, substitution rate: 25%), and 50 g of an acrylic resin represented by the following chemical formula 8 (Mw: 65000).

[0166] [chemical formula 6]

[0167]

[0168] [chemical formula 7]

[0169]

[0170] [chemical formula 8]

[0171]

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Abstract

The present invention is to provide a positive type photoresist composition having excellent storage stability, sensitivity, developing property, resistance to a plating liquid, and heat resistance. More specifically, an oligomer-type particular dissolution inhibitor, which has the same repeating unit structure as a resin contained in the photoresist composition, is applied to the composition.

Description

technical field [0001] Cross References to Related Applications [0002] This application claims priority and benefit from Korean Patent Application No. 10-2017-0097280 filed with the Korean Intellectual Property Office on July 31, 2017, the disclosure of which is incorporated herein by reference in its entirety. [0003] The present invention relates to a positive photoresist composition for forming a thick film, a pattern formed therefrom, and a method for producing the pattern. Background technique [0004] Recently, since semiconductor packages have been converted to wafer-level flip chips, it is possible to increase signal transmission speed and reduce package volume compared to conventional wire-bonded packages. Such flip-chip packaging is handled by using solder bumps or fillers in metal pads on the semiconductor chip instead of conventional wire bonds. [0005] However, for flip-chip packaging using solder bumps, a photoresist for forming a thick film with a thick...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/039G03F7/033G03F7/027G03F7/004G03F7/00
CPCG03F7/039G03F7/033G03F7/027G03F7/004G03F7/0002G03F7/0397G03F7/30G03F7/0392
Inventor 林敏映李泰燮金智慧
Owner LG CHEM LTD
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