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Preparation method for polyimide composite film with high wear resistance and high thermal conductivity

A composite film and polyimide technology, which is applied in the field of preparation of high wear-resistant and high thermal conductivity polyimide composite films, can solve the problems of poor thermal conductivity and friction resistance, cannot meet heat dissipation requirements, etc., and achieves improved friction resistance. performance, improve thermal conductivity, reduce the effect of interface thermal resistance

Inactive Publication Date: 2019-11-19
合肥中汇睿能能源科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, with the development of society, polymers such as polyimide have the advantages of high mechanical strength, good electrical insulation performance and stable chemical properties, so they are widely used in the field of electronic packaging, but their thermal conductivity and friction resistance are poor , cannot meet the heat dissipation requirements of modern high-speed, high-density electrical systems

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] The invention provides a method for preparing a polyimide composite film with high wear resistance and high thermal conductivity. The quality of diaminodiphenyl ether and pyromellitic dianhydride is weighed according to the ratio of 10:8. 100 parts and 80 parts, weigh 1000 parts of acetamide, slowly pour acetamide into the reaction kettle, add diaminodiphenyl ether, pass in protective gas and stir for half an hour to fully dissolve, and then select 75 parts of three-dimensional Add graphene and 25 parts of molybdenum disulfide into the solution, stir for 30 minutes, and finally add pyromellitic dianhydride in batches. At this time, the solution becomes viscous and appears light yellow. It is divided into 80 degrees for 2 hours and 120 degrees. 1 hour, 1 hour at 150 degrees, 1 hour at 200 degrees, 1 hour at 250 degrees, and 1 hour at 300 degrees, heating and stirring for 7 hours to obtain a polyamic acid / three-dimensional graphene molybdenum disulfide composite film.

[...

Embodiment 2

[0022] The invention provides a method for preparing a polyimide composite film with high wear resistance and high thermal conductivity. The quality of diaminodiphenyl ether and pyromellitic dianhydride is weighed according to the ratio of 10:8. 100 parts and 80 parts, weigh 1000 parts of acetamide, slowly pour acetamide into the reaction kettle, add diaminodiphenyl ether, pass in protective gas and stir for half an hour to fully dissolve, and then select 76 parts of three-dimensional Add graphene and 24 parts of molybdenum disulfide into the solution, stir for 30 minutes, and finally add pyromellitic dianhydride in batches. At this time, the solution becomes viscous and appears light yellow. It is divided into 80 degrees for 2 hours and 120 degrees. 1 hour, 1 hour at 150 degrees, 1 hour at 200 degrees, 1 hour at 250 degrees, and 1 hour at 300 degrees, heating and stirring for 7 hours to obtain a polyamic acid / three-dimensional graphene molybdenum disulfide composite film.

[...

Embodiment 3

[0025] The invention provides a method for preparing a polyimide composite film with high wear resistance and high thermal conductivity. The quality of diaminodiphenyl ether and pyromellitic dianhydride is weighed according to the ratio of 10:8. 100 parts and 80 parts, weigh 1000 parts of acetamide, slowly pour acetamide into the reaction kettle, add diaminodiphenyl ether, pass in protective gas and stir for half an hour to fully dissolve, and then select 77 parts of three-dimensional Add graphene and 23 parts of molybdenum disulfide into the solution, stir for 30 minutes, and finally add pyromellitic dianhydride in batches. At this time, the solution becomes viscous and appears light yellow. It is divided into 80 degrees for 2 hours and 120 degrees. 1 hour, 1 hour at 150 degrees, 1 hour at 200 degrees, 1 hour at 250 degrees, and 1 hour at 300 degrees, heating and stirring for 7 hours to obtain a polyamic acid / three-dimensional graphene molybdenum disulfide composite film.

[...

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Abstract

The invention provides a preparation method for a polyimide composite film with high wear resistance and high thermal conductivity. The preparation method comprises the following steps: slowly pouringdiaminodiphenyl ether, pyromellitic dianhydride and acetamide into a reaction kettle, adding diaminodiphenyl ether, introducing protective gas, carrying out stirring for half an hour until the abovesubstances are fully dissolved, then selecting three-dimensional graphene and molybdenum disulfide, adding the three-dimensional graphene and the molybdenum disulfide into an obtained solution, carrying out stirring for 30 minutes, adding the pyromellitic dianhydride in batches so as to obtain a viscous and pale-yellow solution, and continuously carrying out heating under stirring for 7 hours so as to obtain a polyamide acid / three-dimensional graphene / molybdenum disulfide composite film. According to the invention, by adoption of the three-dimensional graphene and the molybdenum disulfide as modifying materials of polyimide, a substrate can effectively form a complete thermal-conductive path under the grid structure of the three-dimensional graphene; interface thermal resistance is greatlyreduced; thermal conductivity of the substrate is effectively improved; and through the molybdenum disulfide, tensile strength and friction resistance of a film are improved.

Description

technical field [0001] The invention relates to the technical field of polyimide composite film production technology, in particular to a preparation method of a highly wear-resistant and high thermal conductivity polyimide composite film. Background technique [0002] There are two main types of polyimide composite film, one is high-temperature adhesive film, which is made of polyimide film coated with F46 (polyfluorinated ethylene propylene emulsion) at high temperature on one or both sides. It is referred to as FH or FHF; the other is low-temperature adhesive film, which is made of polyimide film coated with modified polyesterimide adhesive on one side and dried at high temperature. These two products have excellent high and low temperature resistance, electrical insulation, radiation resistance, and high temperature self-adhesive sealing characteristics, and can be used as insulation layers for wires, cables, magnet wires, etc. The difference is that the post-processing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08K3/04C08K3/30C08L79/08C08J5/18
CPCC08G73/1007C08G73/105C08G73/1071C08J5/18C08J2379/08C08K3/042C08K3/30C08K2003/3009
Inventor 王文静
Owner 合肥中汇睿能能源科技有限公司