Kit and reaction chamber

Abstract

The invention provides a kit and a reaction chamber. A pattern structure is arranged on the surface of the kit, and the pattern structure comprises a plurality of concave parts, wherein each concave part comprises a spherical concave surface. The pattern structure not only can effectively improve particle control effect, but also cannot cause injury to the surface of the kit, thereby prolonging use life of the kit.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a process kit and a reaction chamber. Background technique [0002] Physical Vapor Deposition (PVD, Physical Vapor Deposition) technology or sputtering (Sputtering) deposition technology is the most widely used thin film manufacturing technology in the semiconductor industry. Physical vapor deposition technology can be applied to many process fields, such as copper interconnection technology, through silicon via (ThroughSiliconVia, TSV) technology in the packaging field, and so on. [0003] With the continuous development of semiconductor technology, the size of integrated circuits is getting smaller and smaller, and Low-k materials appear in the interconnection process. In order to obtain a better etching morphology and protect the Low-k material to a certain extent, a TiN film is deposited on the Low-k material as a metal hard mask for etching the Low-k mat...

AI Technical Summary

Problems solved by technology

However, grit blasting did not produce enough roughness to improve process kit life significantly and particle control was poor

As for the spraying treatment, although the roughness can be increased to a certain extent, the spraying treatment has relatively large damage to the process kit, which reduces the number of cycles of the process kit

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