A target binding detection system, target binding detection device and method

Abstract

The invention discloses a target binding detection system, device and method, wherein the device includes a control unit, a delivery control unit connected to the control unit, and an overflow prevention unit; the delivery control unit responds to the binding control command issued by the control unit Control the delivery device to deliver the liquid binding material from bottom to top into the filling cavity; the anti-overflow unit detects whether the liquid level of the liquid binding material filled in the filling cavity rises to the level of the highest target, and when the liquid level rises to the highest target When the material is flat, an anti-overflow signal is generated, so that the control unit responds to the anti-overflow signal to control the delivery control unit to stop driving the delivery device to deliver the liquid binding material into the filling cavity. According to the present invention, the binding material is introduced from bottom to top to make the filling uniform, and at the same time, sufficient binding can be ensured, and waste of binding filling material and target contamination caused by filling liquid overflow can be prevented.

Description

technical field [0001] The invention relates to a target binding detection system, a target binding detection device and a method. Background technique [0002] The target is a sputtering source that forms various functional thin films on the substrate by sputtering by magnetron sputtering, multi-arc ion plating or other types of coating systems under appropriate process conditions. There are usually two types of targets: flat targets and rotary targets. Since the utilization rate of flat targets is only 20-30%, rotary targets have gradually become the mainstream products in the industrial coating industry. [0003] When the magnetron sputtering coating target is used, it is necessary to bind the target and the back tube to meet the installation, electrical conductivity and heat dissipation requirements of the production equipment. At present, the most commonly used binding method is to use indium or tin as the binding material. Therefore, the binding technology of the targ...

AI Technical Summary

Problems solved by technology

[0005] This method has the following disadvantages: (1) The binding between the rotating target and the back tube is the contact welding of the entire annular surface, which is easy to generate air bubbles and looseness, which reduces the performance of the back tube or even falls off; (2) the rotation The binding of the target generally uses the rotating target and the back tube as the mold, and the cast metal layer is required between the target and the back tube as the connecting layer, so the longer the rotating target, the thinner the tube wall, and the uniformity of casting The more difficult it is to control, the lower the binding welding rate, and some targets will be deformed when they are bound for too long; (3) Usually, in order to ensure that the rotating target and the entire annular surface of the back tube are welded as much as possible, continuous casting The binding material overflows after reaching the highest target level, which causes waste of binding material and target contamination due to liquid overflow

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