A silicon chip edge protection device

Abstract

The invention relates to the field of integrated circuit manufacturing, and in particular relates to a silicon wafer edge protection device which comprises a protection ring, a horizontal grasping ring mechanism and a vertical conveying mechanism. The horizontal grasping ring mechanism is used for horizontally grasping and lowering the protection ring. The vertical conveying mechanism is detachably connected above the horizontal grasping ring mechanism. The vertical conveying mechanism can drive the horizontal grasping ring mechanism to move vertically, and can pull the horizontal grasping ring mechanism upward when power is lost. According to the silicon wafer edge protection device provided by the invention, the horizontal grasping ring mechanism can be pulled up when abnormal conditionssuch as sudden power failure or gas outage occur, which prevents the horizontal grasping ring mechanism from colliding with a worktable; a silicon wafer is effectively protected; the maintenance convenience of the device is improved; and the accuracy of vertical movement is improved.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a silicon chip edge protection device. Background technique [0002] Lithography equipment is mainly used in the manufacture of integrated circuits IC or other micro-devices. Using a photolithography device, a mask pattern can be imaged on a silicon wafer coated with photoresist. The lithography device exposes through the projection objective lens, and transfers the designed mask pattern to the photoresist. As the core component of the lithography device, the edge protection of the silicon wafer is important to realize the function of the edge protection device of the silicon wafer during the exposure process of the negative resist process. influences. [0003] The silicon chip edge protection device in the prior art uses a protective ring to cover the edge of the silicon chip to protect the edge of the silicon chip from being exposed during the exposure process....

AI Technical Summary

Problems solved by technology

In case of sudden power failure or gas failure, the protection device cannot automatically return to the zero position, which may easily cause the collision between the protection ring 4' and the workpiece table 6', damage the work table 6' and the silicon wafer 5', and pose a safety hazard ; In addition, the assembly accuracy and vertical motion accuracy of the silicon wafer edge protection device in the prior art are very low, and deviation faults are prone to occur when the protection ring 4' is handed over to the workpiece table 6', resulting in problems such as poor reliability of the equipment; and the vertical There are only the initial position and the handover position in the movement stroke, and the maintenance of the device is very inconvenient

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