flip method

A technology of flip chip and solder column, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., to avoid collapse and avoid short circuit

Active Publication Date: 2022-01-25
NANTONG FUJITSU MICROELECTRONICS
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in the existing flip-chip method, adjacent solder layers are easily connected together

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • flip method
  • flip method
  • flip method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] As mentioned in the background, the flip-chip method formed in the prior art will result in poor quality of the solder layer, and adjacent solder layers are easily connected together.

[0020] Figure 1 to Figure 2 is a schematic diagram of the structure of the flip-chip method.

[0021] refer to figure 1 , providing a semiconductor chip 100, a conductive connecting column 110 and a carrier plate 130, the conductive connecting column 110 has an opposite first surface and a second surface; the conductive connecting column 110 is fixed on the surface of the semiconductor chip 100, the first Facing the semiconductor chip 100; the solder ball 140 is fixedly arranged on the second surface of the conductive connection column 110; after that, the semiconductor chip 100, the conductive connection column 110 and the solder ball 140 are placed on the surface of the carrier board 130, and the solder ball 140 is connected to the surface of the carrier plate 130. The carrier board...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

A flip-chip method, comprising: providing a semiconductor chip and a conductive connection post, the conductive connection post having opposite first surfaces and a second surface; fixing the conductive connection post on the surface of the semiconductor chip, with the first surface facing the semiconductor chip; a carrier board is provided; solder pillars are formed on the surface of the carrier board; a barrier layer is formed, the barrier layer is located on the surface of the carrier board around the solder pillars; after the barrier layer is formed, the solder pillars and The second surface is in contact, and the conductive connection post is located on the solder post; after the solder post is brought into contact with the second surface, reflow soldering is performed, and the solder post forms a solder layer. The method avoids connecting adjacent solder layers together.

Description

technical field [0001] The invention relates to the packaging field, in particular to a flip-chip method. Background technique [0002] The flip chip process is not only a chip interconnection technology, but also an ideal chip bonding technology. As early as more than 50 years ago, IBM (International Business Machines Corporation) has developed and used this technology. But until recent years, flip-chip has become a frequently used package formation in the field of high-end devices and high-density packaging. At present, the application range of flip-chip packaging technology is becoming wider and wider, and the packaging forms are becoming more diversified, and the requirements for flip-chips are also increasing. [0003] However, in the existing flip-chip method, adjacent solder layers are easily connected together. Contents of the invention [0004] The problem solved by the present invention is to provide a flip-chip method which avoids connecting adjacent solder l...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49H01L21/48
CPCH01L23/49H01L21/4885H01L2924/181H01L2224/16225H01L2924/00012
Inventor 石磊
Owner NANTONG FUJITSU MICROELECTRONICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap