Complex pulse laser deep hole machining device based on Bessel beams

A Bessel beam and composite pulse technology, applied in the field of composite pulse laser deep hole processing devices, can solve the problems of low efficiency, low positioning accuracy of composite pulse laser processing, etc., and achieve the goal of improving processing accuracy and ensuring transmission stability Effect

Active Publication Date: 2020-01-03
JIANGSU UNIV
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Problems solved by technology

[0004] In order to solve the problems of high depth-to-diameter ratio gas film hole processing taper, low efficiency and low positioning accuracy of composite pulse la

Method used

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  • Complex pulse laser deep hole machining device based on Bessel beams
  • Complex pulse laser deep hole machining device based on Bessel beams
  • Complex pulse laser deep hole machining device based on Bessel beams

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Embodiment Construction

[0027] Such as figure 2 As shown, it includes: step S1 of compound pulse laser step-by-step processing, short pulse laser energy output, to realize the preliminary processing of microholes; step S2 ultrashort pulse energy output, to realize the material removal of micropore recasting layer and heat-affected area generated by S1 .

[0028] In the figure, the function of the first thin film on the upper surface of the double-sided coated plane mirror is to enhance the reflectivity of the 1064nm wavelength laser and reduce the transmittance of the 1062nm wavelength laser; the function of the second thin film on the lower surface is to enhance the transmittance of the 532nm wavelength laser , Reduce the reflectivity of 532nm wavelength laser.

[0029] The principle of double-sided coated flat mirror: the film that enhances the transmitted light is called an anti-reflection film, and the film that enhances the reflected light is called an anti-reflection film. Its principle is t...

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Abstract

The invention discloses a complex pulse laser deep hole machining device based on Bessel beams. The complex pulse laser deep hole machining device comprises a short/ultrashort pulse laser light source, a two-sided coated planar mirror, a small-aperture diaphragm, a frequency multiplication crystal, a collimating mirror, a 1/4 wave plate, a Gauss-Bessel conversion device and a scanning galvanometer; complex pulse laser is utilized for microporous stepwise machining; firstly, the advantage of short pulse laser of being high in machining efficiency is utilized for preliminary machining of micropores, and then the advantages of ultrashort pulse laser of being high in machining precision and having a small heat-affected zone are utilized for removing a recast layer and the heat-affected zone ofpreliminarily-machined micropores. The properties of the Bessel beams of being small in spot diameter and large in focal depth are utilized for processing the micropores with a large depth-diameter ratio; the two-sided coated planar mirror and the small-aperture diaphragm are utilized for coaxial beam combination, then through the frequency multiplication device, the wavelength of the complex laser is unified, the transmission stability of the complex pulse laser in the same optical system is guaranteed, and the machining precision of the complex pulse laser is improved.

Description

technical field [0001] The invention belongs to the field of laser processing, in particular to a compound pulse laser deep hole processing device based on Bessel beams. Background technique [0002] Micropore manufacturing has important applications in aerospace, microfluidic devices, electronic components and other related fields. With the rapid development of science and technology, traditional processing methods can no longer meet the requirements of micropore processing, especially for aeroengines. Processing of tiny holes with large depth-to-diameter ratios on components. Laser microhole processing has been applied in various microhole processing due to its advantages of non-contact and the ability to process almost any material. Laser microhole processing technology can be mainly divided into three types according to the pulse width: long pulse laser processing, short pulse laser processing, etc. Pulse laser processing and ultrashort pulse laser laser processing. Am...

Claims

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Application Information

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IPC IPC(8): B23K26/382B23K26/0622
CPCB23K26/0622B23K26/0624B23K26/382
Inventor 任乃飞辛志铎任云鹏林卿陆恒
Owner JIANGSU UNIV
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