Copper wire tinplating device
A copper wire tinning and tinning device technology, applied in hot-dip plating process, coating, metal material coating process, etc., can solve the problem of tin slag, small point contact friction, and tin adhesion without setting up a tin block melting device Ineffective and other problems, to achieve the effect of easy detection and control, increase friction, and reduce waste
Inactive Publication Date: 2020-01-03
王生红
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Problems solved by technology
[0005] The technical problem to be solved by the present invention is: the balls of the wire inlet assembly of the current device will cause damage during the movement of the copper wires, and the contact mode between the balls and the copper wires is a point contact friction force, which cannot ensure that the copper wires move evenly. The adhesion effect of tin is poor, and the design is complex and energy-consuming, which brings difficulty to later maintenance. There is no tin block melting device and the reduction treatment of tin slag, which is easy to cause the problem of clogging. The invention provides a new copper wire plating tin device
Method used
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[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. For the convenience of description, if the words "up", "down", "left" and "right" appear in the following, it only means that the directions of up, down, left and right are consistent with the drawings themselves, and do not limit the structure. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0025] like Figures 1 to 4 A copper wire tinning device shown includes a main tinning device 2, and the left side of the tinning device 2 is provided with a pickling device 1 and a wire reel 5 to separate it, and the right side of the t...
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The invention relates to a copper wire tinplating device, and belongs to the technical field of copper wire machining. The copper wire tinplating device can avoid damage to a copper wire and then optimize the adhesion effect of tin, and is provided with a set of system for treating tin blocks, reducing the formation of tin slag, and maximizing the cyclic utilization of resources. The copper wire tinplating device mainly comprises a acid pickling device, a tin plating device and a drying device, wherein wire holes on wire plates on the two sides of the acid pickling device and the tin plating device are provided with sealing assemblies, a wire port assembly is provided with a V-shaped rubber rolling wheel with a spring, a tin furnace is arranged on the upper side of the tin plating device,the tin furnace is provided with a hole and is connected with the interior of the drying device through a vent tube, a fan is arranged at the position, adjacent to the drying device, of the vent tube,hot air in the tin furnace is pumped into the drying device, and a constant temperature device is arranged inside the tin plating device so as to further reduce the generation of the tin slag and guarantee the tin plating effect.
Description
technical field [0001] The invention relates to the technical field of copper wire processing, in particular to a copper wire tinning device. Background technique [0002] Due to its excellent performance and low price, copper is widely used in the fields of electronic information, lubrication, catalysis and metallurgy. But copper is easily oxidized in the air, and the finer the particle size, the more serious the oxidation. Tinned copper wire has been widely used in industrial production and daily life due to its beautiful appearance, high tensile strength, solderability and anti-aging properties. Its coating of inert metal layer can not only significantly improve copper Anti-oxidation performance, and can better maintain its conductivity. Although tin is not an inert metal and its properties are more active than copper, tin is very stable in the air at room temperature, because a dense oxide film will form on the surface of tin to prevent tin from continuing to oxidize. ...
Claims
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IPC IPC(8): C23C2/08C23C2/02C23C2/38C23G3/02
CPCC23C2/003C23C2/02C23C2/08C23C2/38C23G3/027
Inventor 王生红
Owner 王生红