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Preparation method of micro-debonding sample of heterogeneous cured resin system

A curing resin and sample preparation technology, which is applied in fiber types, textiles and papermaking, fiber processing, etc., can solve the problems of large test errors, low interface shear strength, and dispersion, and achieve the effect of uniform distribution and small errors

Active Publication Date: 2020-01-07
AVIC BASIC TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the test error of this method is large at present, one of the reasons is the control in the sample preparation process.
Especially when the resin is a latent curing resin system, due to the heterogeneous distribution of the curing agent system, the degree of internal curing of the micro-debonding sample is severely uneven, and the resulting interfacial shear strength is not only low, but also has Very large dispersion, so the data given by the evaluation unit cannot be used as a valid reference

Method used

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  • Preparation method of micro-debonding sample of heterogeneous cured resin system
  • Preparation method of micro-debonding sample of heterogeneous cured resin system

Examples

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Effect test

Embodiment 1

[0026] A method for preparing a micro-debonding sample of a heterogeneous solidification resin system, comprising the following steps:

[0027] (1) Pre-polymerize the epoxy resin with dicyandiamide curing system at 140°C for 70 minutes, or pre-polymerize at 152°C for 25 minutes. After the pre-polymerization, the viscosity of the pre-polymerized resin at the corresponding temperature is 1.5Pa.s, The size of particle aggregates in the resin detected by laser light scattering is about 1.2 μm;

[0028] (2) Quickly apply the pre-polymerized resin on the glass fiber at the corresponding temperature to form microspheres, and then cure the formed liquid microspheres under the curing conditions required for resin curing (177°C / 120min) to obtain a The glass fiber monofilament of the resin microspheres is cooled to below 60°C after solidification and taken out, and the microspheres with a diameter of 60±5 μm are screened as test samples for micro-debonding test.

[0029] The micro-debon...

Embodiment 2

[0031] A method for preparing a micro-debonding sample of a heterogeneous solidification resin system, comprising the following steps:

[0032] (1) Pre-polymerize the epoxy resin with dicyandiamide / polyurea curing system at 80°C for 70 minutes, or pre-polymerize at 90°C for 35 minutes, or pre-polymerize at 95°C for 20 minutes. After the pre-polymerization, the temperature The viscosities of the lower prepolymerized resins are 0.8Pa.s, 1.3Pa.s and 2.5Pa.s respectively, and the size of particle aggregates in the resin detected by laser light scattering method are 2.2μm, 1.2μm and 0.8μm respectively;

[0033] (2) At the corresponding temperature, the resin after the prepolymerization is quickly coated on the carbon fiber to form microspheres, and then the formed liquid microspheres are cured under the curing conditions (120°C / 120min) required for resin curing to obtain The carbon fiber monofilament of cured resin microspheres is cooled to below 60°C after curing and taken out, an...

Embodiment 3

[0036] A method for preparing a micro-debonding sample of a heterogeneous solidification resin system, comprising the following steps:

[0037] (1) Pre-polymerize the epoxy resin with medium-temperature curing boron trifluoride-monoamine curing system at 85°C for 25 minutes. After the pre-polymerization, the viscosity of the pre-polymerized resin at this temperature is about 2.1Pa.s, and the laser light scattering The size of particle aggregates in the resin detected by the method is 0.6 μm;

[0038] (2) At this temperature, the pretreatment resin is quickly coated on the aramid fiber to form microspheres, and then the formed liquid microspheres are cured under the curing conditions (130°C / 120min) required for resin curing to obtain microspheres with cured resin The aramid fiber monofilament is cooled to below 60°C after solidification and taken out, and the microspheres with a size of 58-75 μm are screened as test samples for micro-debonding test.

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Abstract

The invention relates to a preparation method of a micro-debonding sample of a heterogeneous cured resin system. The preparation method is especially suitable for testing the interfacial shear strength between resin and fibers in a heterogeneous curing system. By adopting a resin pre-polymerization treatment method, the uniformity distribution in the resin is improved, the viscosity and the microsphere size are controlled, a test sample with good test stability is obtained, the result stability and accuracy of the test sample are remarkably improved, and the interface bonding capacity betweenthe resin system and the fibers can be accurately reflected.

Description

technical field [0001] The invention relates to the technical field of testing composite materials, in particular to a method for preparing a micro-debonding sample of a heterogeneous curing resin system. Background technique [0002] Compared with traditional metal materials, continuous fiber-reinforced resin-based composites have lower density, higher specific strength and specific stiffness, and are more and more widely used in aerospace, petroleum, transportation, sports equipment and other fields. For continuous fiber-reinforced resin-based composites, the interface between fibers and resin acts as a connection and stress transfer between fibers and resins, which is an important factor affecting the static mechanical properties and fatigue mechanical properties of composite materials, and the interface shear strength is also an important factor for interface properties How to accurately obtain the interfacial shear strength is the key to material development and perform...

Claims

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Application Information

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IPC IPC(8): C03C25/26C03C25/12D06M15/55D06M15/59
CPCC03C25/26C03C25/12D06M15/55D06M15/59D06M2101/40D06M2101/36
Inventor 郭妙才李亚锋洪旭辉
Owner AVIC BASIC TECH RES INST