Preparation method of micro-debonding sample of heterogeneous curing resin system
A curing resin and sample preparation technology, which is applied in fiber processing, textiles and papermaking, fiber types, etc., can solve the problems of large test error, low interface shear strength, uneven curing degree of micro-debonding samples, and achieve error Small, evenly distributed effects
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Embodiment 1
[0026] A method for preparing a micro-debonding sample of a heterogeneous solidification resin system, comprising the following steps:
[0027] (1) Pre-polymerize the epoxy resin with dicyandiamide curing system at 140°C for 70 minutes, or pre-polymerize at 152°C for 25 minutes. After the pre-polymerization, the viscosity of the pre-polymerized resin at the corresponding temperature is 1.5Pa.s, The size of particle aggregates in the resin detected by laser light scattering is about 1.2 μm;
[0028] (2) Quickly apply the pre-polymerized resin on the glass fiber at the corresponding temperature to form microspheres, and then cure the formed liquid microspheres under the curing conditions required for resin curing (177°C / 120min) to obtain a The glass fiber monofilament of the resin microspheres is cooled to below 60°C after solidification and taken out, and the microspheres with a diameter of 60±5 μm are screened as test samples for micro-debonding test.
[0029] The micro-debon...
Embodiment 2
[0031] A method for preparing a micro-debonding sample of a heterogeneous solidification resin system, comprising the following steps:
[0032] (1) Pre-polymerize the epoxy resin with dicyandiamide / polyurea curing system at 80°C for 70 minutes, or pre-polymerize at 90°C for 35 minutes, or pre-polymerize at 95°C for 20 minutes. After the pre-polymerization, the temperature The viscosities of the lower prepolymerized resins are 0.8Pa.s, 1.3Pa.s and 2.5Pa.s respectively, and the size of particle aggregates in the resin detected by laser light scattering method are 2.2μm, 1.2μm and 0.8μm respectively;
[0033] (2) At the corresponding temperature, the resin after the prepolymerization is quickly coated on the carbon fiber to form microspheres, and then the formed liquid microspheres are cured under the curing conditions (120°C / 120min) required for resin curing to obtain The carbon fiber monofilament of cured resin microspheres is cooled to below 60°C after curing and taken out, an...
Embodiment 3
[0036] A method for preparing a micro-debonding sample of a heterogeneous solidification resin system, comprising the following steps:
[0037] (1) Pre-polymerize the epoxy resin with medium-temperature curing boron trifluoride-monoamine curing system at 85°C for 25 minutes. After the pre-polymerization, the viscosity of the pre-polymerized resin at this temperature is about 2.1Pa.s, and the laser light scattering The size of particle aggregates in the resin detected by the method is 0.6 μm;
[0038] (2) At this temperature, the pretreatment resin is quickly coated on the aramid fiber to form microspheres, and then the formed liquid microspheres are cured under the curing conditions (130°C / 120min) required for resin curing to obtain microspheres with cured resin The aramid fiber monofilament is cooled to below 60°C after solidification and taken out, and the microspheres with a size of 58-75 μm are screened as test samples for micro-debonding test.
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