IC card
A card body and protective layer technology applied to IC cards. It can solve the problems of separation and falling off, card damage, surface peeling off, etc., and achieve the effect of preventing surface peeling, prolonging service life and reducing aging effect
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Embodiment 1
[0019] Embodiment 1: refer to figure 1 with figure 2 , an IC card, comprising a card body 8, the card body consists of a first hydrophobic layer 1, a first protective layer 2, a first printed layer 3, a chip layer 4, a second printed layer 5, a second protective layer 6, a second The hydrophobic layer 7 is laminated sequentially, and the side of the card body 8 is laminated with an anti-peeling collar 9 .
[0020] After the traditional IC card is used for a period of time, the surface layer of the IC card is prone to peeling off, and the surface layer peeling off is most likely to occur on the side of the IC card, that is, the edge position of each layer. By being provided with an anti-peeling collar 9, it can effectively adhere Fix each layer of the IC card, improve the adhesion of each layer of the IC card at the edge, and prevent the surface layer of the IC card from peeling off.
[0021] In order to prevent the IC card from being peeled off due to water immersion during...
Embodiment 2
[0028] Embodiment 2, with reference to figure 1 with image 3 , the present embodiment is basically the same as Embodiment 1, the difference is that in this embodiment, in order to reduce the aging effect of external ultraviolet rays on the IC card and prolong the service life of the IC card, further, the first protective layer 2 and the second protective layer The outer surface of 6 is vapor-deposited with the first anti-ultraviolet layer 14 and the second anti-ultraviolet layer 15 respectively, the first anti-ultraviolet layer 14 and the second anti-ultraviolet layer 15 have the same composition and structure, the first anti-ultraviolet layer 14 and the second anti-ultraviolet layer Layer 15 is any one of silicon oxide / titanium dioxide binary vapor deposition layer and titanium dioxide / tungsten trioxide binary vapor deposition layer.
[0029] In order to facilitate the collection of IC cards, further, the card body 8 is also provided with a hanging hole 10 . Multiple IC ca...
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Abstract
Description
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Application Information
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