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Electroplating leveling agent and electroplating solution thereof

A leveling agent and solution technology, applied in the field of electroplating leveling agent and its electroplating solution, can solve problems such as uneven copper thickness, and achieve the effects of reducing production costs, improving depth capability, and enhancing leveling and suppression capabilities.

Inactive Publication Date: 2020-01-14
深圳海恩特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current distribution is more at the edge and protrusion of the plated substrate, and less in the central part of the plated substrate, which leads to uneven copper thickness on the plated substrate during the plating process

Method used

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  • Electroplating leveling agent and electroplating solution thereof
  • Electroplating leveling agent and electroplating solution thereof
  • Electroplating leveling agent and electroplating solution thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0034] The preparation method of the electroplating leveling agent is as follows: in the process of preparing the electroplating leveling agent, the quaternizing agent can be added into the reaction vessel together with the amine compound and the epoxy compound to start the reaction. Add the amine compound, the epoxy compound and the quaternizing agent into the reaction vessel according to the above-mentioned feeding ratio, then add an appropriate amount of water, and stir at room temperature. Then, the temperature of the reaction system is raised to 75-85°C for 8-10 hours of polymerization, and then cooled to room temperature to obtain a brown-yellow viscous solution, which is the electroplating leveler.

[0035] It is also possible to add amine compounds and epoxy compounds first, and after a period of reaction, add a quaternizing agent to continue the reaction. Add the amine compound and the epoxy compound into the reaction vessel according to the above-mentioned feeding ra...

Embodiment 1-6

[0050]

[0051]

Embodiment 1

[0053] Take a 500ml double-necked round bottom flask and attach a condenser to the flask. Add 0.002 moles of aniline (structural formula is ) and 0.4 moles of 1,4-butanediol diglycidyl ether (the structural formula is ). Add 40 ml of water and stir at room temperature for 10 minutes. Thereupon, the temperature of the reaction system was raised to 80° C. for polymerization for 3 hours, and then 0.0002 moles of methyl iodide (structural formula CH 3 1), continue to react and be cooled to room temperature after 6 hours, obtain brownish-yellow viscous solution, be electroplating leveler.

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Abstract

The invention discloses an electroplating leveling agent. The electroplating leveling agent is prepared through a reaction of one or more kinds of amine compounds, one or more kinds of epoxy compoundsand one or more kinds of quaternization reagents. Each epoxy compound comprises two or more epoxy groups, and the feeding mole ratio of the amine compounds to the epoxy compounds to the quaternization reagents is 1:(0.05-200):(0.1-100). According to the electroplating leveling agent, by introducing the quaternization reagents, amidogen in molecules is further quaternized, and the obtained electroplating leveling agent has good inhibition and leveling capacity. The electroplating leveling agent is matched with metal ions, an electrolyte solution, halogen ions, an inhibitor, a brightener and the like, decorative electroplating and priority electroplating in holes can be achieved, including but not limited to equal-wall electroplating and ultra-equal-wall electroplating for through holes andblind holes, and the deep capacity of the electroplating solution is greatly improved.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to an electroplating leveler and an electroplating solution. Background technique [0002] Electroplating technology is widely used in various industrial production fields. Electroplating can achieve the decoration and protection of the substrate, and can provide optical, electrical, magnetic, thermal and other physical properties. Electroplating technology also plays an important role in the circuit board manufacturing process. In the circuit board production process, the layers of the circuit board are connected to each other through through holes, buried holes or blind holes to form a current path between the circuit board and the device and between the internal layers of the circuit board. These circuits are usually implemented by electroless copper plating followed by electroplating copper. In order to ensure the reliability of the circuit, through-hole plating is usu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/02C25D3/38
CPCC25D3/02C25D3/38
Inventor 彭博宇
Owner 深圳海恩特科技有限公司
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