Polymer-based composite dielectric material, preparation method thereof and energy storage device

A technology of dielectric materials and polymers, applied in coatings and other directions, can solve the problems of increased cost, low molecular chain polarity, and inability to meet the temperature requirements of film capacitors, reducing energy loss, high energy storage density, and improving dielectric properties. The effect of electrical properties and breakdown field strength

Pending Publication Date: 2020-01-21
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although the working temperature can be increased to 105°C after modification, it still cannot meet the temperature requirements of film capacitors in many application fields, and the increase in cost cannot be ignored.
Polyimide (PI) has good thermal stability and can withstand high temperatures, but due to its low molecular chain polarity, the corresponding energy storage density is only 1.4J / cm 3 (Reference 1: Thakur VK, Gupta R K. Recent progress on ferroelectric polymer-based nanocomposites for high energy density capacitors: synthesis, dielectric properties, and future aspects: ChemRev, 2016, 116(7): 4260-4317.)

Method used

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  • Polymer-based composite dielectric material, preparation method thereof and energy storage device
  • Polymer-based composite dielectric material, preparation method thereof and energy storage device
  • Polymer-based composite dielectric material, preparation method thereof and energy storage device

Examples

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Embodiment 1

[0024] This embodiment provides a polymer-based composite dielectric material PEI / PI / PEI-1, which is prepared according to the following steps:

[0025] (1) Dissolve PEI (polyetherimide) in N, N-dimethylformamide to obtain the PEI solution required for the first polymer layer, and also as the required polymer solution for the odd-numbered layers in the multilayer structure . Soluble PI (polyimide) is dissolved in N-methylpyrrolidone to obtain the PI solution required for the second polymer layer, that is, the polymer solution required for the even-numbered layer in the multilayer structure.

[0026] (2) Cast the PEI solution on the glass substrate, and then dry it in an oven for 30 minutes to form a PEI film; then, in the same way, cast the PI solution on the surface of the PEI film to form a PI film, and cast a layer of PEI film on the surface of the PI film again , and finally place it in an oven to dry for 8 hours to obtain a composite dielectric film with a three-layer st...

Embodiment 2

[0030] This embodiment provides a polymer-based composite dielectric material PEI / PI / PEI / PI, which is prepared according to the following steps:

[0031] (1) Dissolve PEI (polyetherimide) in N, N-dimethylformamide to obtain the PEI solution required for the first polymer layer, and also as the required polymer solution for the odd-numbered layers in the multilayer structure . Soluble PI (polyimide) is dissolved in N-methylpyrrolidone to obtain the PI solution required for the second polymer layer, that is, the polymer solution required for the even-numbered layer in the multilayer structure.

[0032] (2) Cast the PEI solution on the glass substrate, and then dry it in an oven for 30 minutes to form a PEI film; then, in the same way, cast the PI solution on the surface of the PEI film to form a PI film, and cast a layer of PEI film on the surface of the PI film again , and then cast a PI layer on the surface of the PEI film, and finally place it in an oven to dry for 8 hours t...

Embodiment 3

[0036] This embodiment provides a polymer-based composite dielectric material PEI / PI / PEI / PI / PEI, which is prepared according to the following steps:

[0037] (1) Dissolve PEI (polyetherimide) in N, N-dimethylformamide to obtain the PEI solution required for the first polymer layer, and also as the required polymer solution for the odd-numbered layers in the multilayer structure . Soluble PI (polyimide) is dissolved in N-methylpyrrolidone to obtain the PI solution required for the second polymer layer, that is, the polymer solution required for the even-numbered layer in the multilayer structure.

[0038] (2) Cast the PEI solution on the glass substrate, and then dry it in an oven for 30 minutes to form a PEI film; then, in the same way, cast the PI solution on the surface of the PEI film to form a PI film, and cast a layer of PEI film on the surface of the PI film again , and so on, alternately cast PEI and PI layers, and finally place it in an oven to dry for 8 hours to obta...

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Abstract

The invention discloses a polymer-based composite dielectric material, a preparation method thereof and an energy storage device. The polymer-based composite dielectric material comprises a laminatedstructure, the laminated structure is formed by alternately laminating first polymer layers and second polymer layers and then hot-pressing, the dielectric constant of the first polymer layers is higher than that of the second polymer layers, and the glass transition temperature of the first polymer layers and the glass transition temperature of the second polymer layers are both higher than 150 DEG C. The laminated structure adopted by the invention can improve the dielectric property and breakdown field strength of the composite dielectric material; the difference of dielectric constants between layers increases the interfacial polarization of the material, thereby improving the energy storage density of the material, and the polymer-based composite dielectric material provided by the invention can maintain high energy storage efficiency and high energy storage density at high temperature, and has a good application prospect in energy storage devices such as capacitors and the like.

Description

technical field [0001] The invention relates to the technical field of dielectric energy storage materials, in particular to a polymer-based composite dielectric material, a preparation method thereof, and an energy storage device. Background technique [0002] Dielectric energy storage materials have intrinsic fast charge and discharge capabilities, and exhibit the highest power density compared to other energy storage materials. Therefore, dielectric energy storage materials have attracted extensive attention from research institutions and industries around the world. Among them, the polymer-based composite dielectric materials represented by polyvinylidene fluoride (PVDF) have been developed in just a few years, and the energy storage density has exceeded 30J / cm 3 . However, due to the large intrinsic ferroelectric loss, a large amount of energy is converted into heat and cannot be released as electrical energy, resulting in generally low discharge energy efficiency of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J7/04C08L79/08C08K3/24
CPCC08J7/042C08J2379/08C08J2479/08C08K3/24
Inventor 汪宏牛玉娟
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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