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Composite material

A technology of composite materials and alloy copper, which is applied in the direction of conductive materials, conductive materials, metal/alloy conductors, etc., can solve the problems of unfavorable miniaturization and compact configuration, and achieve the effect of thickness reduction and compact design

Inactive Publication Date: 2020-01-21
TAIFLEX SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, computer products, communication products or consumer electronics products are all moving toward component miniaturization and compact configuration. The thickness of the aforementioned passive components will not be conducive to the trend of miniaturization and compact configuration. Therefore, a more advanced structure is required to Miniaturize passive components to reduce thickness of passive components

Method used

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Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0017] As mentioned above, the composition of the adhesive layer 11 of the composite material 1 is 5-45wt% resin material, 5-30wt% additive, 20-60wt% toughening agent, and 0.5-5wt% Hardener, in this experimental example, take a comparison group that does not meet the aforementioned mixing ratio, and three experimental groups that meet the aforementioned mixing ratio to detect its peel strength, its composition is shown in Table 1 below, the comparison group and the experiment The thickness of each group is 25 μm. The experimental method is to coat the comparison group and the experimental group on a 3 mil (MIL) black polyimide film (PI), and press them together at 160 degrees Celsius. After 2 minutes, it is bonded with 0.15mm alloy copper, wherein the alloy copper contains 12.0wt% manganese, 3.0wt% nickel, and the rest is copper. After baking at 160 degrees Celsius for 1.5 hours, the peel strength was measured according to the IPC-TM-6502.4.9 test method, and the measured peel...

experiment example 2

[0022] This experimental example is to test the bonding ability of the adhesive layer 11 to metals of different thicknesses. The two experimental groups respectively take the adhesive layer 11 and apply it to a black polyimide film ( PI), press together at 160 degrees Celsius for 2 minutes, then bond with 0.15mm and 0.3mm alloy copper respectively, and bake at 160 degrees Celsius for 1.5 hours, and finally use IPC-TM-6502.4. 9 test method for measurement, the measured peel strength is shown in Table 2 below.

[0023] Table II

[0024]

[0025] From the above experimental results, it can be known that the adhesive layer 11 can maintain a good peel strength even for alloy copper with a thickness greater than that of the present embodiment, which shows that its adhesion ability is indeed excellent.

[0026] In this first embodiment, the manganese content contained in the metal layer 12 of the composite material 1 is 12.0 wt%, the nickel content is 3.0 wt%, and the rest is cop...

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Abstract

A composite material, which is applied to a passive assembly, comprises a metal layer and an insulation layer stacked on the metal layer. The resistivity of the metal layer is 1*10<-8> to 150*10<-8> [omega]m. The metal layer of the composite material comprises a copper alloy, and the thickness of the whole composite material is 66 to 325 [mu]m. Compared with a conventional laminated layer, the thickness is greatly reduced, and thus a passive assembly containing the composite material can be minimized and compacted to meet the market requirements.

Description

technical field [0001] The invention relates to a composite material, in particular to a miniaturized composite material. Background technique [0002] A passive component is an electronic component connected to an active component that only consumes energy but cannot generate it, such as resistors, capacitors, inductors, etc. A composite stack in a general passive component is formed by a copper layer, an adhesive layer laid on one side of the copper layer, and a ceramic substrate layer fixed on the adhesive layer and stacked on the copper layer . Generally speaking, limited by material properties, the thickness of the copper layer is approximately in the range of 150 μm to 300 μm, the thickness of the adhesive layer is approximately 50 μm to 100 μm, and the thickness of the ceramic substrate layer is approximately 300 μm, therefore The total thickness of the composite laminate is about 500 μm to 700 μm. However, in recent years, computer products, communication products...

Claims

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Application Information

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IPC IPC(8): H01B5/14H01B1/02
CPCH01B5/14H01B1/026
Inventor 吴修竹杨佳勋
Owner TAIFLEX SCI