Reusable silicon wafer chamfer edge grinding wheel and manufacturing method thereof
A manufacturing method and chamfering technology, applied in the field of grinding wheels, can solve the problems of environmental pollution, high use cost, waste, etc., and achieve the effect of reducing use cost, reasonable design and good flatness
Pending Publication Date: 2020-02-11
杨金全
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Problems solved by technology
[0002] At present, the silicon wafer outer round chamfering (edging) grinding wheel is manufactured by electroplating, which has the following shortcomings: 1. Pollution of the environment, the electroplating solution, acid and alkali used in the electroplating process have serious pollution to the environment.
2. The working layer is thin, (within 1mm) for one-time use, resulting in great waste and high cost of use
The v-groove of the substrate is formed by machining first, and then the diamond is electroplated. The electroplating process cannot guarantee the smoothness and uniformity of the distribution of diamond particles, which will cause chipping, burrs and other unqualified phenomena when the silicon wafer is processed by the grinding wheel.
Method used
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[0025] In order to illustrate the present invention more clearly, the present invention will be further described below in conjunction with preferred embodiments. Those skilled in the art should understand that the content specifically described below is illustrative rather than restrictive, and should not limit the protection scope of the present invention.
[0026] Such as figure 1 and 2 As shown, a reusable silicon chip chamfering and edging grinding wheel includes: a base body 1, an installation hole 2, a working layer 4 and a groove body 5; an installation hole 2 is opened in the center of the base body 1; A working layer 4 is set, and the thickness of the working layer 4 is 3-20 mm; a groove body 5 is provided on the working layer 4 .
[0027] Further, the groove body 5 is a V-shaped groove, and the V-shaped groove is processed by electric discharge equipment or laser equipment, so as to meet the chamfering size requirement of the silicon wafer.
[0028] Further, the ...
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Abstract
The invention discloses a reusable silicon wafer chamfer edge grinding wheel and a manufacturing method thereof. The reusable silicon wafer chamfer edge grinding wheel comprises a base body, a mounting hole, a working layer and grooves. The center of the base body is provided with the mounting hole. The edge of the outer side of the base body is provided with the working layer. The working layer is provided with the grooves. The reusable silicon wafer chamfer edge grinding wheel is simple in structure and reasonable in design. As being manufactured through a bronze bonding agent, the silicon wafer chamfer edge grinding wheel is usable, achieves the effects of energy conservation and emission reduction and can be used repeatedly and reduce the using cost.
Description
technical field [0001] The invention relates to the technical field of grinding wheels, in particular to a reusable silicon wafer chamfering and edging grinding wheel and a manufacturing method thereof. Background technique [0002] At present, the silicon chip excircle chamfering (edging) grinding wheel adopts the electroplating method to manufacture, and there are following deficiencies: 1, pollute the environment, the electroplating solution that the electroplating process uses, acid, alkali all have serious pollution to the environment. 2. The working layer is thin, (within 1mm) for one-time use, resulting in great waste and high cost of use. The V-groove of the substrate is formed by machining first, and then diamond is electroplated. The electroplating process cannot guarantee the smoothness and uniformity of the distribution of diamond particles, which will cause chipping, burrs and other unqualified phenomena in the processing of silicon wafers by the grinding wheel....
Claims
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IPC IPC(8): B24D5/00B24D5/16B24D18/00
CPCB24D5/00B24D5/16B24D18/0009
Inventor 杨金全
Owner 杨金全