Composite metal foil
A composite metal and metal foil layer technology, applied in the field of materials, can solve the problems of carrier layer and metal foil layer bonding, carrier layer and metal foil layer being difficult to peel off, mutual diffusion, etc.
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[0045] see Figure 5 As shown, in order to solve the same technical problem, the embodiment of the present invention also provides a preparation method for preparing the composite metal foil, comprising the following steps:
[0046] S11, forming a carrier layer 1;
[0047] S12, forming a metal bonding layer 22 on one side of the carrier layer 1;
[0048] S13, forming a high temperature resistant layer 21 on the metal bonding layer 22, the metal bonding layer 22 and the high temperature resistant layer 21 constitute a barrier layer 2;
[0049] S14, forming a release layer 3 on the barrier layer 2;
[0050] S15 , forming a metal foil layer 4 on the peeling layer 3 .
[0051] In order to ensure that the carrier layer 1, the barrier layer 2 and the release layer 3 can be easily peeled off from the metal foil layer 4 at the same time when the composite metal foil is used, in the embodiment of the present invention, At a temperature of 20-400° C., the peel strength between the c...
Embodiment 1
[0073] S41, forming the carrier layer 1 by electroplating, roughening the carrier layer 1, forming a first anti-oxidation layer on the carrier layer 1, and annealing the carrier layer 1 under heat treatment conditions; wherein, The heat treatment conditions are: the heat treatment temperature is 250°C, and the heating time is 1 hour; the carrier layer 1 is a carrier copper, and the plating solution for forming the carrier layer 1 includes a copper sulfate solution, wherein the carrier layer 1 is formed The copper content of the plating solution is: 20g / L, and the pH value is 7; the plating solution forming the carrier layer 1 also includes additives, and the additives include brightener sodium sulfonate, leveling agent thiourea and wetting agent polyethylene Diol, the massfraction of described brightener sodium sulfonate is 0.8g / L, the massfraction of described leveling agent thiourea is 0.5g / L, the massfraction of described wetting agent polyethylene glycol is 3g / L L. In add...
Embodiment 2
[0080] The difference between this embodiment and Embodiment 1 is that the high temperature resistant layer 21 is a single-layer alloy structure made of tungsten-nickel alloy. Other processes and steps of this embodiment are the same as those of Embodiment 1, and no more details are given here.
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Abstract
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