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Composite metal foil

A composite metal and metal foil layer technology, applied in the field of materials, can solve the problems of carrier layer and metal foil layer bonding, carrier layer and metal foil layer being difficult to peel off, mutual diffusion, etc.

Pending Publication Date: 2020-02-11
GUANGZHOU FANGBANG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the composite metal foil and the flexible insulating base film need to be pressed under high temperature conditions, and the carrier layer and the metal foil layer are prone to interdiffusion under high temperature conditions, resulting in the bonding of the carrier layer and the metal foil layer, making Difficult to peel off between the carrier layer and the metal foil layer

Method used

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Examples

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preparation example Construction

[0045] see Figure 5 As shown, in order to solve the same technical problem, the embodiment of the present invention also provides a preparation method for preparing the composite metal foil, comprising the following steps:

[0046] S11, forming a carrier layer 1;

[0047] S12, forming a metal bonding layer 22 on one side of the carrier layer 1;

[0048] S13, forming a high temperature resistant layer 21 on the metal bonding layer 22, the metal bonding layer 22 and the high temperature resistant layer 21 constitute a barrier layer 2;

[0049] S14, forming a release layer 3 on the barrier layer 2;

[0050] S15 , forming a metal foil layer 4 on the peeling layer 3 .

[0051] In order to ensure that the carrier layer 1, the barrier layer 2 and the release layer 3 can be easily peeled off from the metal foil layer 4 at the same time when the composite metal foil is used, in the embodiment of the present invention, At a temperature of 20-400° C., the peel strength between the c...

Embodiment 1

[0073] S41, forming the carrier layer 1 by electroplating, roughening the carrier layer 1, forming a first anti-oxidation layer on the carrier layer 1, and annealing the carrier layer 1 under heat treatment conditions; wherein, The heat treatment conditions are: the heat treatment temperature is 250°C, and the heating time is 1 hour; the carrier layer 1 is a carrier copper, and the plating solution for forming the carrier layer 1 includes a copper sulfate solution, wherein the carrier layer 1 is formed The copper content of the plating solution is: 20g / L, and the pH value is 7; the plating solution forming the carrier layer 1 also includes additives, and the additives include brightener sodium sulfonate, leveling agent thiourea and wetting agent polyethylene Diol, the massfraction of described brightener sodium sulfonate is 0.8g / L, the massfraction of described leveling agent thiourea is 0.5g / L, the massfraction of described wetting agent polyethylene glycol is 3g / L L. In add...

Embodiment 2

[0080] The difference between this embodiment and Embodiment 1 is that the high temperature resistant layer 21 is a single-layer alloy structure made of tungsten-nickel alloy. Other processes and steps of this embodiment are the same as those of Embodiment 1, and no more details are given here.

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Abstract

The invention relates to the technical field of materials, and discloses a composite metal foil including a carrier layer, a barrier layer, a release layer, and a metal foil layer. The carrier layer,the barrier layer, the release layer, and the metal foil layer are sequentially stacked and arranged. The barrier layer includes a metal bonding layer and a high temperature resistant layer, which arestacked. The metal bonding layer is arranged between the carrier layer and the high temperature resistant layer. The release layer is arranged between the carrier layer and the metal foil layer, which facilitates the peeling of the carrier layer. The barrier layer is arranged between the carrier layer and the metal foil layer, so as to prevent adhesion caused by mutual diffusion of the carrier layer and the metal foil layer at a high temperature. The carrier layer and the metal foil layer are easily peeled off. In addition, the metal bonding layer is arranged between the carrier layer and thehigh temperature resistant layer, so that the barrier layer is not easily separated from the carrier layer. Peeling between the barrier layer and the carrier layer is prevented.

Description

technical field [0001] The invention relates to the technical field of materials, in particular to a composite metal foil. Background technique [0002] At present, the substrate is a processing material of a flexible printed circuit board (Flexible Printed Circuit board, FPC), which is usually composed of a flexible insulating base film and a composite metal foil. When preparing the substrate in the prior art, usually the side of the composite metal foil (including the carrier layer and the metal foil layer) provided with the metal foil layer is pressed together with the flexible insulating base film to obtain the substrate. When using the substrate , the carrier layer needs to be peeled off. However, since the composite metal foil and the flexible insulating base film need to be pressed under high temperature conditions, and the carrier layer and the metal foil layer are prone to interdiffusion under high temperature conditions, resulting in the bonding of the carrier lay...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/02H05K1/09
CPCH05K3/025H05K1/09C25D3/38H05K3/384C25D5/12C25D1/04C25D7/0614C25D5/50Y02E60/10B32B15/08B32B15/20H05K3/16H05K1/0393H05K1/118B32B15/00C23C28/00B32B15/01Y10T428/12C25D5/10
Inventor 苏陟
Owner GUANGZHOU FANGBANG ELECTRONICS