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Micro-hot plate and manufacturing method of micro-hot plate

A manufacturing method and technology of a micro-hot plate, applied in the field of detection, can solve the problems of easy deformation and instability, low structural strength of a silicon-based micro-hot plate, etc.

Inactive Publication Date: 2020-02-18
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this will result in the low structural strength of the existing silicon-based micro-hotplate, and the "sandwich" film structure is easily deformed and unstable at high temperatures.

Method used

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Embodiment Construction

[0057] In order to make the purpose, technical solutions and advantages of the present application clearer, the micro-hotplate and the manufacturing method of the micro-hotplate of the present application will be further described in detail through the following examples and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.

[0058]The serial numbers assigned to components in this document, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequence or technical meaning. The "connection" and "connection" mentioned in this application all include direct and indirect connection (connection) unless otherwise specified. In the description of this application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "t...

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Abstract

The invention relates to a micro-hot plate and a manufacturing method of the micro-hot plate. An adhesion layer is arranged on the surface of a quartz glass substrate. An electrode layer is arranged on one surface of the adhesion layer away from quartz glass. One surface of the quartz glass substrate away from the adhesion layer is provided with a groove. Due to the low thermal conductivity of thequartz glass substrate, the thermal conduction capability between the quartz glass substrate and the environment is poor, so that the power consumption of the micro-hot plate can be reduced, and theenergy utilization efficiency can be improved. At the same time, the quartz glass substrate has the characteristics of insulation and high temperature resistance, so an insulating material can be omitted on the surface of the quartz glass substrate, thereby simplifying the "sandwich" film structure and improving the thermal stability. At the same time, the groove can reduce the heat capacity of the quartz glass substrate and reduce the power consumption. At the same time, the groove has a bottom, therefore, the groove can support the adhesion layer and the electrode layer, thereby enhancing the structural strength, and preventing the adhesion layer and the electrode layer from being damaged due to movement or vibration and other situations because of suspension.

Description

technical field [0001] The present application relates to the detection field, in particular to a micro-hot plate and a method for making the micro-hot plate. Background technique [0002] As an important sensor device, gas sensors are widely used in drilling, chemical smelting, automotive electronics, environmental protection, home security and other fields. With the rise and rapid development of smart sensors and Internet of Things technologies, many application scenarios are becoming more and more sensitive to the size, power consumption, and cost of devices and systems. The gas sensor begins to develop towards the direction of miniaturization, low power consumption and low cost. The micro-hot plate is an indispensable core component in this development process, especially for catalytic combustion type, semiconductor type, heat conduction type and other types. As a miniaturized platform for carrying gas-sensitive materials, providing reaction heat sources, and measuring...

Claims

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Application Information

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IPC IPC(8): G01N27/12
CPCG01N27/128
Inventor 尤政鲁文帅尤睿阮勇
Owner TSINGHUA UNIV
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