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Integrated flexible display module and manufacturing method thereof

A flexible display and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of offset stress, expansion and contraction, bending, etc., and achieve the effect of solving expansion and contraction

Inactive Publication Date: 2020-02-21
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the use of three different materials, OLED modules often have problems such as expansion and contraction, offset or stress caused by different material properties, and even cracks in the case of expansion and contraction and bending.

Method used

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  • Integrated flexible display module and manufacturing method thereof
  • Integrated flexible display module and manufacturing method thereof
  • Integrated flexible display module and manufacturing method thereof

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Embodiment Construction

[0036] Reference in the detailed description to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The same terms appearing in different positions in the specification are not necessarily limited to the same implementation, but should be understood as independent or alternative implementations from other embodiments. Inspired by the technical solutions disclosed in the embodiments provided in the present invention, those skilled in the art should understand that the embodiments described in the present invention may have other combinations or changes of technical solutions consistent with the concept of the present invention.

[0037] Please refer to figure 1 , figure 2 and Figure 4 As shown, the present invention provides an integrated flexible display module 1 , including a flexible substrate 11 , a thin film transistor layer 12 , an organic...

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Abstract

The invention discloses an integrated flexible display module and a manufacturing method of the integrated flexible display module. The integrated flexible display module comprises a flexible substrate, a thin film transistor layer, an organic light-emitting layer, a driving chip and an external port circuit which are stacked in sequence, wherein the flexible substrate comprises a display area anda non-display area, and the non-display area comprises a bending sub-area and a circuit sub-area connected with the bending sub-area; the driving chip is arranged in the circuit sub-area of the flexible substrate and is electrically connected with the wiring of the thin film transistor layer and the organic light-emitting layer; and the external port circuit is arranged in the circuit sub-area ofthe flexible substrate and is electrically connected with the driving chip. Therefore, the flexible display module is simple in structure, the manufacturing process of the module is simplified, and thus the cost is reduced.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an integrated flexible display module and a manufacturing method thereof. Background technique [0002] OLED flexible displays are becoming the research focus of various companies. Compared with rigid screens, flexible OLED displays can be used in a wider range of occasions. Existing flexible OLED displays mainly use polyimide (PI) as a substrate for carrying OLED display devices. Relevant manufacturing technologies are also approaching maturity, but the existing flexible display module structure only changes the substrate of the panel from glass to PI, and does not make any further improvements to other parts. [0003] The existing OLED flexible display module consists of three parts: glass substrate, COF (chip on film) and flexible printed circuit (FPC, flexible printed circuit). The membrane (ACF, anisotropic conductive film) connects the three materials. Due to the use of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30H01L27/32H01L51/00H10K99/00
CPCG09F9/301H10K59/121H10K77/111Y02E10/549Y02P70/50
Inventor 刘峰
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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