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Ultra-micro circuit board based on ultra-thin glue-free flexible carbon-based material and preparation method thereof

A technology of flexible circuit boards and carbon-based materials, which is applied in the direction of circuit substrate materials, printed circuit manufacturing, metal pattern materials, etc., and can solve problems such as poor thermal conductivity of FPC, increased Joule heat generation, and high temperature

Active Publication Date: 2020-02-28
深圳市藤野电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development trend of ultra-thin, flexible, highly integrated and multi-functional electronic instruments, the number of CPU chip I / O terminals is increasing, and the corresponding FPC wiring width and spacing are also sharply narrowed. Joule heat increases, resulting in high temperature, especially when a large amount of Joule heat is generated when a large current passes through the line, the traditional FCCL as the base material of the flexible circuit board FPC will have a risk of circuit fusing due to poor thermal conductivity
On the other hand, with the advent of the 5G high-speed and high-frequency communication era, emerging markets such as artificial intelligence and the Internet of Things have also posed higher challenges to the traditional PCB and FPC industries.

Method used

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  • Ultra-micro circuit board based on ultra-thin glue-free flexible carbon-based material and preparation method thereof
  • Ultra-micro circuit board based on ultra-thin glue-free flexible carbon-based material and preparation method thereof

Examples

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preparation example Construction

[0034] In one embodiment, a method for preparing an ultra-micro circuit board based on an ultra-thin adhesive-free flexible carbon-based material comprises the following steps:

[0035] S1. Depositing a PI film on the surface of the quantum carbon-based film by CVD chemical vapor deposition reaction to produce a flexible circuit board substrate with a quantum carbon-based film / PI double-layer composite structure;

[0036] S2. Fabricate a high-frequency ultra-micro circuit antenna on the flexible circuit board base material by laser scanning etching method.

[0037]With a flexible carbon-based film as a substrate, a flexible circuit board substrate with a double-layer composite structure of quantum carbon-based film / PI (such as 20 μm / 20 μm) is produced by chemical vapor deposition (CVD) on the quantum carbon-based film , this flexible circuit board base material is an ultra-thin adhesive-free flexible carbon-based material, which can replace the new base material of the traditi...

Embodiment 1

[0091] Raw materials:

[0092] 3,3’,4,4’-Biphenyltetracarboxylic dianhydride

[0093] m-phenylenediamine

[0094] Nitrogen (carrier / cleaning gas)

[0095] Quantum carbon-based film (thickness: 20μm)

[0096] steam

[0097] instrument:

[0098] CVD vapor deposition device (Finland)

[0099] PEO601 RTA rapid thermal annealing furnace (Germany)

[0100] Preparation steps:

[0101] S1: Argon plasma modification treatment on the surface of the quantum carbon-based film, the steps are as follows:

[0102] (1) Place the quantum carbon-based film in acetone solution or absolute ethanol, clean it with ultrasonic waves, and then vacuum dry it in a vacuum drying oven;

[0103] (2) Argon plasma treatment is carried out after the treatment is completed, the plasma treatment power is 70W, the working pressure is 70Pa, and the treatment time is 15min;

[0104] (3) After the surface of the quantum carbon-based film is modified by plasma, then chemical treatment is used to graft on th...

Embodiment 2

[0114] The difference from Example 1 is that this is PI prepared from monomer raw materials 2,3,3',4'-diphenyl ether tetraacid dianhydride and 3,3'-diaminodiphenyl ether in quantum carbon CVD vapor deposition on the surface of the base film, the deposition cycle and reaction conditions are: 2,3,3',4'-diphenyl ether tetraacid dianhydride gas pulse (deposition temperature: 170 ° C, pulse time: 3.0s)-N 2 (Purge time: 1.5-3.0s)-3,3’-Diaminodiphenyl ether gas pulse (deposition temperature: 150°C, pulse time: 2.0s)-N 2 (Purge time: 1.5-3.0s). All the other are with embodiment 1.

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Abstract

An ultra-micro circuit board based on an ultra-thin glue-free flexible carbon-based material and a preparation method thereof are disclosed. The method comprises the following steps: S1, depositing aPI film on the surface of a quantum carbon-based film through a CVD chemical vapor deposition reaction and manufacturing a flexible circuit board substrate with a quantum carbon-based film / PI double-layer composite structure; and S2, manufacturing a high-frequency ultra-micro circuit antenna on the flexible circuit board substrate by a laser scanning etching method. The preparation method has theadvantages of good environmental protection, high efficiency, low manufacturing cost and the like, and the manufactured antenna ultra-micro circuit board has advantages of high thermal conductivity, super-flexibility, low dielectric, low loss and high shielding performance, and can be applied to 5G equipment, especially used for manufacturing 5G and next-generation WiFi technology products with high frequency, high shielding, low power consumption and low cost.

Description

technical field [0001] The invention relates to an ultra-micro circuit board based on an ultra-thin glue-free flexible carbon-based material and a preparation method thereof. Background technique [0002] A flexible printed circuit board (FPC) is mainly composed of a flexible insulating base film and a metal foil. It is generally formed by bonding the insulating base film and metal copper foil with an adhesive. A typical flexible substrate material is a flexible substrate. Copper Clad Laminate (FCCL), over the past few decades, FCCL has been used as an important substrate for manufacturing FPC, and its market has expanded rapidly. With the development trend of ultra-thin, flexible, highly integrated and multi-functional electronic instruments, the number of CPU chip I / O terminals is increasing, and the corresponding FPC wiring width and spacing are also sharply narrowed. Joule heating increases, resulting in high temperature, especially when a large amount of Joule heat is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/09H05K1/02H05K3/02H05K1/03H01Q1/38
CPCH05K1/09H05K1/028H05K3/027H05K1/0353H05K1/0216H01Q1/38B05D1/60B05D3/142B05D1/18H05K1/0373H05K2203/087H05K2201/0323H05K2203/107H05K2203/095H05K3/0055H05K2201/0129H05K3/022H05K2201/10098H05K2201/0154H05K2201/0329H05K2203/1136H01Q1/368C23C16/0227C23C16/56H01Q1/241
Inventor 刘萍谢凡张双庆李婷
Owner 深圳市藤野电子科技有限公司