Environment-friendly novel circuit board manufacturing method

A manufacturing method and circuit board technology, which are applied in separation methods, printed circuit manufacturing, chemical instruments and methods, etc., can solve problems such as environmental damage, workshop air environment impact, etc.

Inactive Publication Date: 2020-03-03
绵阳市奇帆科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In the production process of the existing circuit board, a large amount of dust is easily generated due to grinding and drilling, which affects the air environment in th

Method used

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  • Environment-friendly novel circuit board manufacturing method

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Embodiment 1

[0023] A kind of environmental protection novel circuit board manufacturing method, described evaluation method comprises the steps:

[0024] (1) Cut the copper clad laminate, and cut the copper clad laminate into the size of the circuit board according to the demand, not too large, so as to save materials and avoid material waste, and minimize the generation of leftover materials;

[0025] (2) Pretreat the copper clad laminate, and use fine sandpaper to polish off the oxide layer on the surface of the copper clad laminate, so as to ensure that the toner on the thermal transfer paper can be firmly printed on the copper clad laminate when the circuit board is transferred, and the polished The standard is that the surface of the board is bright and there are no obvious stains. When grinding, the dust generated by the grinding is sucked and filtered by the suction fan;

[0026] (3) Transfer the printed circuit board, put the copper clad laminate into the thermal transfer machine ...

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Abstract

The invention discloses an environment-friendly novel circuit board manufacturing method, which comprises the following steps: a copper-clad board is cut to the size of a circuit board, and the size is not too large so as to save materials; the copper-clad board is preprocessed, the oxide layer on the surface of the copper-clad board is ground off with fine abrasive paper so as to ensure that carbon powder on heat transfer paper can be firmly printed on the copper-clad board when the circuit board is transferred; the circuit board is transferred, the printed circuit board is cut into a propersize, and the surface printed with the circuit board is attached to the copper-clad board; the circuit board is corroded, the circuit board is put into corrosive liquid for corrosion, and the circuitboard after the copper film is completely corroded is taken out; the circuit board is drilled, different drill needles are selected according to the thickness of the pins of electronic components to drill the circuit board; and the circuit board is pretreated, powdered ink covering the circuit board is ground off through fine abrasive paper, the circuit board is cleaned through clear water, afterthe water is dried, rosin water is smeared on the face, provided with the circuit, of the circuit board, and rosin solidification is accelerated through a hot-air blower.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a novel environment-friendly method for manufacturing a circuit board, and belongs to the field of circuit board production technology application. Background technique [0002] The names of circuit boards are: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, ultra-thin Thin circuit boards, printed circuit boards, etc., circuit boards make circuits miniaturized and intuitive, and play an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. [0003] In the production process of the existing circuit board, a large amount of dust is easily generated due to grinding and drilling, which affects the air environment in the workshop, and when pretr...

Claims

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Application Information

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IPC IPC(8): H05K3/00C02F9/04B01D46/00
CPCH05K3/0055H05K3/0085C02F1/66C02F1/001B01D46/00
Inventor 刘金海葛永亮许永鹏裴一帆申剑李群河刘烨方玮麟袁志敏
Owner 绵阳市奇帆科技有限公司
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