Polishing treatment method of surface of back plate of target material

A processing method and target material technology, which is applied in the direction of grinding/polishing equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as rust and burrs that are difficult to remove, low polishing efficiency, and sputtering target scrapping, etc., to achieve High industrial application value, uniform polishing texture, and improved polishing efficiency
CN110877235AActive Publication Date: 2020-03-13KONFOONG MATERIALS INTERNATIONAL CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
KONFOONG MATERIALS INTERNATIONAL CO LTD
Publication Date
2020-03-13

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Abstract

The invention provides a polishing treatment method of the surface of a back plate of a target material. The polishing treatment method of the surface of the back plate of the target material comprises the steps that a target material assembly is inversely arranged in a magnetic polishing device, the back plate of the target material faces upward, and magnetic polishing treatment is carried out. The polishing efficiency is high, polishing lines on the surface of the back plate of the target material are uniform and disordered after polishing, the back plate of the target material is not proneto rusting, rust and burrs in holes of the back plate of the target material can be removed cleanly, the requirements of sputtering of the back plate of the target material are well met, and relatively high industrial application value is achieved.
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Description

technical field

[0001] The invention relates to the technical field of target processing, in particular to a method for polishing the surface of a target back plate. Background technique

[0002] Physical vapor deposition (Physical Vapor Deposition, PVD) is the most common sputtering process in the manufacture of semiconductor chip liquid crystal displays. In the sputtering process, the target assembly is composed of a sputtering target meeting the sputtering performance and a target backing plate with a certain hardness and electrical conductivity. It plays a supporting role in the sputtering platform and is used as a conductor in the sputtering process.

[0003] In the existing technology, after the sputtering target and the target back plate are welded, there will be burrs on the edge, and the copper material is easy to rust. The surface is processed by turning process, and it is vacuum packaged after cleaning and then directly provided to customers. Used without other ...

Claims

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