Polishing treatment method of surface of back plate of target material

A processing method and target material technology, which is applied in the direction of grinding/polishing equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as rust and burrs that are difficult to remove, low polishing efficiency, and sputtering target scrapping, etc., to achieve High industrial application value, uniform polishing texture, and improved polishing efficiency

Active Publication Date: 2020-03-13
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing technology, after the sputtering target and the target back plate are welded, there will be burrs on the edge, and the copper material is easy to rust. The surface is processed by turning process, and it is vacuum packaged after cleaning and then directly provided to customers. use, no other surface treatment
However, in the prior art, the target backplane is prone to oxidation, and once oxidized, it will affect the conductivity of the target backplane, which may cause abnormal discharge or power failure of the sputtering target during the sputtering process. phenomenon, which in turn affects the quality of the sputtering target, and even causes the scrapping of the sputtering target
[0004] Therefore, according to the above situation, it is necessary to optimize the surface treatment process of the target backplane to solve the problem that the target backplane is prone to oxidation in the prior art
[0005] CN106312565A discloses a processing method of a target assembly. The method adopts rough polishing and fine polishing multiple polishing processes to polish the target back plate of the target assembly, but the method uses velvet sandpaper to manually polish the target back plate. Polishing treatment, the polishing efficiency is low and the polished texture of the target back plate after polishing has orientation, and it will also cause a certain amount of silicon residue
[0006] CN106346344A discloses a method for treating the surface of a copper target. The method uses polished flannelette and bagel cloth to polish the surface of the copper target. This method also has the problems of low efficiency and orientation of the polished lines
[0007] CN102586743A discloses a method for making a target structure. The method uses water-based sandpaper to polish the target back plate to achieve polishing. This method is not only inefficient but also prone to silicon residues, and is also prone to rust for the copper target back plate
[0008] To sum up, the efficiency of polishing the surface of the target back plate in the existing technology is low, the polishing lines have a certain orientation, and there will be some silicon residue on the surface after polishing with sandpaper, and the copper material is easy to rust after being placed for a certain period of time after polishing; There will be more holes on the board, and the rust and burrs in the holes are not easy to remove

Method used

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  • Polishing treatment method of surface of back plate of target material
  • Polishing treatment method of surface of back plate of target material
  • Polishing treatment method of surface of back plate of target material

Examples

Experimental program
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Effect test

Embodiment 1

[0066] This embodiment provides a method for polishing the surface of a target back plate, the method comprising the following steps:

[0067] (1) The target assembly is placed upside down in the magnetic polishing machine, with the target back plate facing upwards, a 3cm high pad is placed below the target of the target assembly, and the target surface of the target assembly is covered with a cleaning cloth; Add the polishing solution in the magnetic polishing machine, the height of the polishing solution in the magnetic polishing machine is 4cm higher than the height of the target assembly, the polishing solution includes water, abrasive and carboxylic acid, the volume concentration of the abrasive in the polishing solution is 20%, and the volume concentration of carboxylic acid in the polishing solution is 10%; Add three kinds of grinding steel needles of different specifications in the magnetic polishing machine, and the diameters of the grinding steel needles of the three ...

Embodiment 2

[0070] This embodiment provides a method for polishing the surface of a target back plate, the method comprising the following steps:

[0071] (1) The target assembly is placed upside down in the magnetic polishing machine, with the target back plate facing upwards, a 2cm high pad is set below the target of the target assembly, and the target surface of the target assembly is covered with a cleaning cloth; First add water in the magnetic polishing machine, the height of the water in the magnetic polishing machine is 3cm higher than the height of the target assembly, then add abrasives in the magnetic polishing machine, and further add sulfur in the magnetic polishing machine acid, add four kinds of grinding steel needles of different specifications in the magnetic polishing machine, the diameters of the grinding steel needles of the four specifications are respectively 0.2mm, 0.5mm, 0.8mm and 1.0mm, and the lengths are respectively 1mm, 1.5 mm, 3.5mm and 4mm; the total volume ...

Embodiment 3

[0074] This embodiment provides a method for polishing the surface of a target back plate, the method comprising the following steps:

[0075] (1) Put the target assembly upside down in the magnetic polishing machine, with the target back plate facing up, and set a 4cm high pad under the target of the target assembly, and the target surface of the target assembly is covered with a target protection layer; add polishing solution in the magnetic polishing machine, the height of the polishing solution in the magnetic polishing machine is 5cm higher than the height of the target assembly, and the polishing solution includes water, abrasive, carboxylic acid and sulfonic acid, and the abrasive is polishing The volume concentration in the solution is 30%, and the volume concentration of carboxylic acid and sulfonic acid in the polishing solution is 15%; Add three kinds of grinding steel needles of different specifications in the magnetic polishing machine, and the grinding steel needl...

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Abstract

The invention provides a polishing treatment method of the surface of a back plate of a target material. The polishing treatment method of the surface of the back plate of the target material comprises the steps that a target material assembly is inversely arranged in a magnetic polishing device, the back plate of the target material faces upward, and magnetic polishing treatment is carried out. The polishing efficiency is high, polishing lines on the surface of the back plate of the target material are uniform and disordered after polishing, the back plate of the target material is not proneto rusting, rust and burrs in holes of the back plate of the target material can be removed cleanly, the requirements of sputtering of the back plate of the target material are well met, and relatively high industrial application value is achieved.

Description

technical field [0001] The invention relates to the technical field of target processing, in particular to a method for polishing the surface of a target back plate. Background technique [0002] Physical vapor deposition (Physical Vapor Deposition, PVD) is the most common sputtering process in the manufacture of semiconductor chip liquid crystal displays. In the sputtering process, the target assembly is composed of a sputtering target meeting the sputtering performance and a target backing plate with a certain hardness and electrical conductivity. It plays a supporting role in the sputtering platform and is used as a conductor in the sputtering process. [0003] In the existing technology, after the sputtering target and the target back plate are welded, there will be burrs on the edge, and the copper material is easy to rust. The surface is processed by turning process, and it is vacuum packaged after cleaning and then directly provided to customers. Used without other ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/00B24B57/02
CPCB24B1/005B24B57/02
Inventor 姚力军潘杰边逸军王学泽廖培君
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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