Thin film thermal-sensitive printing head and manufacturing method thereof

A technology of thermal print head and manufacturing method, which is applied in printing and other directions, can solve the problems of high cost and slow welding speed of gold wire connecting IC and aluminum circuit, and achieve the effects of fast welding speed, high production efficiency and reduced production cost

Pending Publication Date: 2020-03-17
厦门芯瓷科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above problems, the object of the present invention is to provide a thin film thermal print head with low cost and fast welding speed and its manufact

Method used

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  • Thin film thermal-sensitive printing head and manufacturing method thereof
  • Thin film thermal-sensitive printing head and manufacturing method thereof
  • Thin film thermal-sensitive printing head and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0048] like Figure 1-5 As shown, a thin-film thermal print head includes a substrate 1, a thermal storage layer, a resistance layer 3, a conductive layer 4, a protective layer 5, an anti-oxidation layer 6, a driver IC 7 and a protective layer 8, and the substrate 1 is alumina ceramics plate.

[0049] The substrate 1 is divided into adjacent first part 11 and second part 12 , the length direction of the substrate 1 is the X direction in the figure, and the width direction is the Y direction in the figure. The thermal storage layer includes a protruding portion 21 provided on the first part 11 of the substrate 1 and a base part 22 provided on the second part 12 of the substrate 1. The thermal storage layer is made of glass glaze with a thickness of 10um-500um.

[0050] The resistance layer 3 covers the outside of the substrate 1 and the heat storage layer. The resistance layer 3 has several heat generating parts 31 arranged at intervals along the length direction of the substr...

Embodiment 2

[0060] like Figure 6-9 As shown, the difference between this embodiment and the first embodiment is that the material of the conductive layer 4 is one of copper, tin, copper alloy, and tin alloy. A first connection layer 91 is provided between the conductive layer 4 and the resistance layer 3 , and a second connection layer 92 is provided between the protective layer 5 and the conductive layer 4 . The material of the first connection layer 91 and the second connection layer 92 is one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy, and aluminum alloy. Both the first connection layer 91 and the second connection layer 92 have a thickness of 0.1 nm˜20 μm. The rest of the structure of this embodiment is the same as that of Embodiment 1.

[0061] The manufacturing method of the thin film thermal printhead of the present embodiment comprises the following steps:

[0062] The first step is to apply glass glaze on the surface of the first par...

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Abstract

The invention discloses a thin film thermal-sensitive printing head. The thin film thermal-sensitive printing head comprises a base plate, a thermal storage layer, a resistive layer, a conducting layer, a protective layer, an anti-oxidation layer, drive ICs and a protecting layer; the thermal storage layer comprises an uplift part and a base body part which are arranged on the base plate; the outer sides of the base plate and the thermal storage layer are covered with the resistive layer, and the resistive layer is provided with a plurality of heat-emitting parts; the conducting layer is arranged on the outer side of the resistive layer and comprises a plurality of electrodes capable of forming alloys with soldering tin, the conducting layer is etched at the top of the uplift part, and theheat-emitting part of the resistive layer is exposed; the protective layer is arranged on the outer side of the heat-emitting part; the conducting layer on a second part of the base plate is coveredwith the anti-oxidation layer; and the drive ICs are laid in the length direction of the base plate and connected with the conducting layer on the second part of the base plate in a face-down welded mode. The invention further discloses a manufacturing method of the thin film thermal-sensitive printing head. Aluminum circuits in an existing thermal-sensitive printing head are replaced by the electrodes made of metal and capable of forming the alloys with the soldering tin, the drive ICs adopt face-down welding to replace existing gold wire welding, the cost is low, and the welding speed is high.

Description

technical field [0001] The invention relates to the technical field of thermal printing devices, in particular to a film thermal printing head and a manufacturing method thereof. Background technique [0002] The thermal print head is the main component of the thermal printer. The thermal printer selectively heats the thermal paper at a certain position, and the resulting graphics are generated. Heating is provided by a small electronic heater on the printhead that is in contact with the thermally sensitive material. The form of the heater scheduling square point or bar is logically controlled by the printer, and when driven, a graphic corresponding to the heating element will be produced on the thermal paper. The same logic that controls the heating elements also controls the paper feed, thus enabling graphics to be printed across the entire label or paper. [0003] "Thin film" is a production process of thermal print head. The thin film process is mainly used on the cera...

Claims

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Application Information

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IPC IPC(8): B41J2/32B41J2/335
CPCB41J2/32B41J2/3351B41J2/3353B41J2/33535B41J2/33505B41J2/3359
Inventor 陈龙翰程双阳赵艳秋
Owner 厦门芯瓷科技有限公司
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