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Conductive photosensitive resin for photocuring 3D printing and preparation method thereof

A 3D printing and photosensitive resin technology, applied in the direction of additive processing, etc., can solve the problems of electromagnetic wave interference, explosion or fire, static electricity accumulation, etc., and achieve the effect of enhancing electrical conductivity, fast molding speed, and improving molding speed

Inactive Publication Date: 2020-03-17
XIANGYA HOSPITAL CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, pure polymer materials are insulating materials, which will cause static electricity accumulation, electromagnetic wave interference and other hazards during use.
If it is used to manufacture mining pipes, powder conveying pipelines or oil pipelines, logistics pallets and shelves and other products and used in high-risk environments, it is easy to cause a large amount of static electricity to accumulate due to the friction between the resin pipe wall or the loading frame and the load. explosion or fire

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] (1) Prepare raw materials according to the following ratio:

[0018] 35 parts of ethylene-vinyl acetate copolymer,

[0019] 25 parts polyurethane acrylate,

[0020] 15 parts of copper-aluminum-iron-nickel alloy micron powder,

[0021] 1 part of titanate coupling agent,

[0022] 21 parts of neopentyl glycol diacrylate,

[0023] 0.5 part of dimethyl polysiloxane,

[0024] BYK-306 leveling agent 0.5 parts,

[0025] 2 parts of benzophenone.

[0026] (2) In the three-necked glass flask equipped with a stirrer and a condenser tube, add ethylene-vinyl acetate copolymer, polyurethane acrylate, conductive filler, titanate coupling agent, neopentyl glycol diacrylate, Dimethicone, BYK-306 leveling agent, benzophenone;

[0027] (3) The temperature of the above mixed liquid was raised to 50° C., and stirred with a stirrer for about 60 minutes to obtain a uniform liquid, that is, to prepare a conductive photosensitive resin for photocuring 3D printing. The test performance of...

Embodiment 2

[0029] (1) Prepare raw materials according to the following ratio:

[0030] 20 parts of ethylene-vinyl acetate copolymer,

[0031] 10 parts polyurethane acrylate,

[0032] 30 parts of copper-aluminum-iron-nickel alloy micron powder,

[0033] 2 parts of titanate coupling agent,

[0034] 30 parts of neopentyl glycol diacrylate,

[0035] 2 parts of dimethyl polysiloxane,

[0036] BYK-306 leveling agent 2 parts,

[0037] 4 parts of benzophenone.

[0038] (2) In the three-necked glass flask equipped with a stirrer and a condenser tube, add ethylene-vinyl acetate copolymer, polyurethane acrylate, conductive filler, titanate coupling agent, neopentyl glycol diacrylate, Dimethicone, BYK-306 leveling agent, benzophenone;

[0039] (3) The temperature of the above mixed solution was raised to 40° C., and stirred with a stirrer for about 80 minutes to obtain a uniform liquid, that is, to prepare a conductive photosensitive resin for photocuring 3D printing.

[0040] The test perfo...

Embodiment 3

[0042] (1) Prepare raw materials according to the following ratio:

[0043] 25 parts of ethylene-vinyl acetate copolymer,

[0044] 25 parts polyurethane acrylate,

[0045] 20 parts of carbon black,

[0046] 3 parts of titanate coupling agent,

[0047] 15 parts of neopentyl glycol diacrylate,

[0048] 3.5 parts of dimethyl polysiloxane,

[0049] 3.5 copies of BYK-306 leveling agent,

[0050] Benzophenone 5 parts.

[0051] (2) In the three-necked glass flask equipped with a stirrer and a condenser tube, add ethylene-vinyl acetate copolymer, polyurethane acrylate, conductive filler, titanate coupling agent, neopentyl glycol diacrylate, Dimethicone, BYK-306 leveling agent, benzophenone;

[0052] (3) The temperature of the above mixed liquid was raised to 45° C., and stirred with a stirrer for about 90 minutes to obtain a uniform liquid, that is, to prepare a conductive photosensitive resin for photocuring 3D printing.

[0053] The test performance of the prepared conductiv...

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PUM

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Abstract

The invention discloses a conductive photosensitive resin for photocuring 3D printing. The conductive photosensitive resin for photocuring 3D printing comprises the following components by mass: 25-40parts of an ethylene-vinyl acetate copolymer, 20-35 parts of urethane acrylate, 15-30 parts of conductive filler, 1-5 parts of a titanate coupling agent, 10-25 parts of neopentyl glycol diacrylate, 0.5-5 parts of dimethyl polysiloxane, 0.5-5 parts of a BYK-306 leveling agent and 2-10 parts of benzophenone. According to the invention, the conductive photosensitive resin for 3D printing adopts theethylene-vinyl acetate copolymer and urethane acrylate as the matrix, also is added with the conductive filler, and at the same time utilizes the interaction of the ethylene-vinyl acetate copolymer and the conductive filler to further enhance the conductivity, therefore the conductive photosensitive resin disclosed by the invention not only keeps high curing efficiency, but also has good conductivity.

Description

technical field [0001] The invention belongs to the technical field of photocuring 3D printing, and in particular relates to a conductive photosensitive resin for photocuring 3D printing and a preparation method thereof. Background technique [0002] In recent years, with the rapid advancement of polymer materials technology, various new polymer materials, especially high-strength, multi-functional resin materials are developing in the direction of safety, environmental protection, recyclability and multi-purpose compounding. However, pure polymer materials are insulating materials, which will cause static electricity accumulation, electromagnetic wave interference and other hazards during use. If it is used to manufacture mining pipes, powder conveying pipelines or oil pipelines, logistics pallets and shelves and other products and used in high-risk environments, it is easy to cause a large amount of static electricity to accumulate due to the friction between the resin pip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/08C08L75/14C08L83/04C08K3/08C08K5/10C08K5/07C08K3/04C08F283/00C08F255/02C08F222/14B33Y70/00
CPCC08L23/0853C08L75/14C08F283/008C08F255/026B33Y70/00C08K2201/001C08K2201/011C08L2205/03C08L83/04C08K3/08C08K5/10C08K5/07C08K3/04
Inventor 刘刚刘军黄靖栋陈子华龚连生曹煜彭瑛曹兴
Owner XIANGYA HOSPITAL CENT SOUTH UNIV
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