Preparation method for PEEK with topological pattern on surface

A topology and pattern technology, applied in the field of PEEK preparation, can solve the problems of PEEK surface melting, difficult to maintain regular patterns, unable to meet the pattern requirements of sub-micron scale, etc., to increase the cell adhesion rate and topological morphology The effect of controllable and good application prospects

Inactive Publication Date: 2020-03-24
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, these methods cannot controllably change the surface structure of PEEK or design diverse surface micro-topologies by themselves.
However, the use of laser processing will cause serious melting of the PEEK surface, and it is difficult to maintain a regular pattern; and due to the limitation of the laser beam size, the pattern resolution is not high, and the pattern requirements of the sub-micron scale cannot be achieved, and large-scale surface patterns cannot be realized at the same time. change

Method used

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  • Preparation method for PEEK with topological pattern on surface
  • Preparation method for PEEK with topological pattern on surface
  • Preparation method for PEEK with topological pattern on surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] This embodiment provides a method for preparing PEEK with a topological pattern on the surface, and the steps are as follows:

[0049] (1) Using photolithography combined with ICP, a topological pattern is prepared on the surface of a titanium substrate to obtain a template with a topological pattern on the surface;

[0050] (2) Put the PEEK powder on the template with the topological pattern on the surface obtained in step (1), cold press for 3 minutes at a temperature of 22°C and a pressure of 100 MPa, and press the PEEK powder into a shape while making the template The topological pattern is transferred to the pressed PEEK surface;

[0051] (3) Separate the template from the pressed PEEK by mechanical force to obtain a PEEK with a topological pattern on the surface.

[0052] According to GB / T 22315-2008 (Test Method for Modulus of Elasticity and Poisson's Ratio of Metallic Materials), the elastic modulus of PEEK provided in this embodiment is measured to be 422.6 MPa, which ...

Embodiment 2

[0054] This embodiment provides a method for preparing PEEK with a topological pattern on the surface. The difference from embodiment 1 is that the cold pressing pressure in step (2) is 400 MPa.

[0055] According to GB / T 22315-2008 (Test method for elastic modulus and Poisson's ratio of metallic materials), the elastic modulus of PEEK provided in this embodiment is measured to be 633.7 MPa, which conforms to the range of human cancellous bone modulus. Using a scanning electron microscope to observe the surface morphology of the PEEK provided in this example, the results are as follows figure 2 Shown. by figure 2 It can be seen that the topological structure of the PEEK surface provided by this embodiment is clear, and its structure is denser than that of Embodiment 1.

Embodiment 3

[0057] This embodiment provides a method for preparing PEEK with a topological pattern on the surface. The difference from Embodiment 1 is that the cold pressing pressure in step (2) is 600 MPa and the topological pattern is different.

[0058] According to GB / T 22315-2008 (Test method for elastic modulus and Poisson's ratio of metallic materials), the elastic modulus of PEEK provided in this embodiment is measured to be 633.12 MPa, which is in line with the range of human cancellous bone modulus. Using a scanning electron microscope to observe the surface morphology of the PEEK provided in this example, the results are as follows image 3 Shown. by image 3 It can be seen that the topological structure of the PEEK surface provided by this embodiment is clear, and its structure is denser than that of Embodiment 1.

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Abstract

The invention provides a preparation method for PEEK with a topological pattern on the surface. The preparation method comprises the following steps of: (1) placing a PEEK material on a template witha topological pattern on the surface, carrying out compression molding on the PEEK material through cold pressing, hot pressing or a method of firstly carrying out cold pressing and then carrying outheating, and meanwhile, transferring the topological pattern on the template to the surface of the PEEK subjected to compression molding; and (2) separating the template from the PEEK subjected to compression molding to obtain the PEEK with the topological pattern on the surface. According to the method provided by the invention, the autonomously designed topological pattern can be formed on the surface of the PEEK in a large area, the formed topological pattern has relatively high resolution, and the elasticity modulus of the patterned PEEK can be adjusted by adjusting the extrusion forming condition so as to adapt to different application requirements.

Description

technical field [0001] The invention belongs to the technical field of medical implant materials, and in particular relates to a preparation method of PEEK with topological patterns on the surface. Background technique [0002] Titanium and titanium alloys have always been the traditional choice of bone implant materials due to their good physical and chemical properties, mechanical properties, fatigue resistance and corrosion resistance. However, the elastic modulus of titanium is much higher than that of human compact bone (titanium is 110GPa, and compact bone is only 14GPa). This difference directly produces a stress shielding effect, resulting in almost no stress around the compact bone, resulting in The bone undergoes bone atrophy and bone resorption. In addition, studies have shown that titanium implants can cause allergic reactions in the body. Many studies are currently devoted to finding alternative materials for traditional titanium bone implants. [0003] In th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/02B29C43/58B29K71/00
CPCB29C43/02B29C43/58B29C2043/5808B29C2043/5816B29C2043/025B29K2071/00
Inventor 任富增朱明余黄金财王晓飞何进
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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