Preparation method of power packaging module, power packaging module and storage medium

A technology for encapsulating modules and power, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve the problems of delamination of the package, poor bonding force between the lead frame and epoxy resin, reduction of moisture and heat resistance of power modules, and reliability. performance and service life

Inactive Publication Date: 2020-03-24
GD MIDEA AIR-CONDITIONING EQUIP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Integrate multiple power devices, drive circuits, and MCUs, and obtain intelligent power modules through packaging and other processes. In related technologies, before epoxy resin packaging is completed, solder, Soldering flux, glue and other residues will easily lead to poor bonding between the lead frame and epoxy resin after the plastic packaging is completed, and the package is prone to delamination, which reduces the moisture and heat resistance, reliability and service life of the power module

Method used

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  • Preparation method of power packaging module, power packaging module and storage medium
  • Preparation method of power packaging module, power packaging module and storage medium
  • Preparation method of power packaging module, power packaging module and storage medium

Examples

Experimental program
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Embodiment 1

[0042] Such as figure 1 As shown, the preparation method of a power package module according to an embodiment of the present invention includes:

[0043] In step S102, an insulating layer and a wiring layer are arranged on the substrate, and the wiring layer includes wiring and soldering areas capable of being electrically connected to each other.

[0044] Step S104, preparing a multi-layer film at a designated position of the welding area.

[0045] Wherein, the introduction of solder and soldering flux in the solder layer is beneficial to be reduced by arranging multi-layer thin films.

[0046] In step S106, according to the layout of the power packaging module, a plurality of devices in the power packaging module are respectively fixed on multi-layer films to form a pretreatment module.

[0047] Specifically, such as figure 2 As shown, as a layout method of the power package module, it specifically includes: the first rectification output pin DC-N, the second rectificati...

Embodiment 2

[0086] The power package module according to an embodiment of the present invention is prepared by the above preparation method.

[0087] The power packaging module may specifically include a substrate; an insulating layer covering the substrate; a wiring layer arranged on the insulating layer; multiple devices and the wiring layer can configure a power drive circuit in the power packaging module; the multiple devices include: a rectifier, It is used to convert the input AC signal into a DC signal; the power factor correction module is arranged on the substrate and can be electrically connected to the output terminal of the rectifier to receive the DC signal; the control chip is electrically connected to the power factor correction module for The control signal is output to the power factor correction module, and the power factor correction module performs a power factor correction operation on the DC signal according to the control signal.

[0088] In this embodiment, a method ...

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Abstract

The invention provides a preparation method of a power packaging module, the power packaging module and a storage medium, the preparation method comprises the steps of configuring an insulating layerand a wiring layer on a substrate, wherein the wiring layer comprises wiring and welding areas which can be electrically connected with each other; preparing a multi-layer film at a specified position of the welding area; respectively fixing a plurality of devices in the power packaging module on the plurality of layers of films according to the arrangement mode of the power packaging module so as to form a preprocessing module; heating and cooling the preprocessing module, and performing wiring connection on the cooled preprocessing module to form a to-be-cleaned module; and performing cleaning operation and sealing operation on the to-be-cleaned module to form the power packaging module. According to the technical scheme, the binding force between the metal connecting wire and the leadframe and the binding force between the metal substrate and the packaging shell are enhanced, and therefore the damp-heat resistance and reliability of the intelligent power module are improved, and the service life of the intelligent power module is prolonged.

Description

technical field [0001] The present invention relates to the technical field of packaging, and more specifically, to a method for preparing a power packaging module, a power packaging module, and a computer-readable storage medium. Background technique [0002] Integrate multiple power devices, drive circuits, and MCUs, and obtain intelligent power modules through packaging and other processes. In related technologies, before epoxy resin packaging is completed, solder, Soldering flux, glue and other residues will easily lead to the deterioration of the bonding force between the lead frame and the epoxy resin after the plastic packaging is completed, and the delamination of the package body will easily occur, which reduces the moisture and heat resistance, reliability and service life of the power module. [0003] In addition, any discussion of the background technology in the entire specification does not mean that the background technology must be the prior art known to thos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L21/48
CPCH01L21/4825H01L21/56
Inventor 张宇新冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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